Cold spray deposition of copper electrodes on silicon and glass substrates

Do Yeon Kim; Jung Jae Park; Jong Gun Lee; Donghwan Kim; Sung Ju Tark; Sejin Ahn; Jae Ho Yun; Jihye Gwak; Kyung Hoon Yoon; Sanjeev Chandra; Sam S. Yoon

doi:10.1007/s11666-013-9953-4

Cold spray deposition of copper electrodes on silicon and glass substrates

Do Yeon Kim, Jung Jae Park, Jong Gun Lee, Donghwan Kim, Sung Ju Tark, Sejin Ahn, Jae Ho Yun, Jihye Gwak, Kyung Hoon Yoon, Sanjeev Chandra, Sam S. Yoon

Research output: Contribution to journal › Article › peer-review

59 Citations (Scopus)

Abstract

Copper lines with widths varying from 150 to 1500 μm were deposited onto crystalline silicon wafers and soda-lime glass plates by cold spraying copper particles with 1 μm average diameter through a mask. This direct deposition method yielded high-aspect-ratio electrodes with minimum shadowing effects and maximum electrode-to-silicon contact area. The copper lines had triangular cross sections with aspect ratios (height/width) ranging from 0.1 to 1.1, depending on the number of spray gun passes. Copper particles were densely packed with increasing the width of the masking slit. This study presents the potential use of the cold spray technology in printing lines as front electrodes in solar cell applications.

Original language	English
Pages (from-to)	1092-1102
Number of pages	11
Journal	Journal of Thermal Spray Technology
Volume	22
Issue number	7
DOIs	https://doi.org/10.1007/s11666-013-9953-4
Publication status	Published - 2013 Oct

Keywords

coating glass
cold spray
copper electrode
line printing
solar cell

ASJC Scopus subject areas

Condensed Matter Physics
Surfaces, Coatings and Films
Materials Chemistry

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10.1007/s11666-013-9953-4

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@article{c07565d1604941da9815b6bc8f4f463b,

title = "Cold spray deposition of copper electrodes on silicon and glass substrates",

abstract = "Copper lines with widths varying from 150 to 1500 μm were deposited onto crystalline silicon wafers and soda-lime glass plates by cold spraying copper particles with 1 μm average diameter through a mask. This direct deposition method yielded high-aspect-ratio electrodes with minimum shadowing effects and maximum electrode-to-silicon contact area. The copper lines had triangular cross sections with aspect ratios (height/width) ranging from 0.1 to 1.1, depending on the number of spray gun passes. Copper particles were densely packed with increasing the width of the masking slit. This study presents the potential use of the cold spray technology in printing lines as front electrodes in solar cell applications.",

keywords = "coating glass, cold spray, copper electrode, line printing, solar cell",

author = "Kim, {Do Yeon} and Park, {Jung Jae} and Lee, {Jong Gun} and Donghwan Kim and Tark, {Sung Ju} and Sejin Ahn and Yun, {Jae Ho} and Jihye Gwak and Yoon, {Kyung Hoon} and Sanjeev Chandra and Yoon, {Sam S.}",

note = "Funding Information: This work was supported by the Human Resources Development of the Korea Institute of Energy Technology Evaluation and Planning (KETEP, No. 20104010100640), and the Converging Research Center Program through the Ministry of Education, Science and Technology (2010K000969).",

year = "2013",

month = oct,

doi = "10.1007/s11666-013-9953-4",

language = "English",

volume = "22",

pages = "1092--1102",

journal = "Journal of Thermal Spray Technology",

issn = "1059-9630",

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TY - JOUR

T1 - Cold spray deposition of copper electrodes on silicon and glass substrates

AU - Kim, Do Yeon

AU - Park, Jung Jae

AU - Lee, Jong Gun

AU - Kim, Donghwan

AU - Tark, Sung Ju

AU - Ahn, Sejin

AU - Yun, Jae Ho

AU - Gwak, Jihye

AU - Yoon, Kyung Hoon

AU - Chandra, Sanjeev

AU - Yoon, Sam S.

N1 - Funding Information: This work was supported by the Human Resources Development of the Korea Institute of Energy Technology Evaluation and Planning (KETEP, No. 20104010100640), and the Converging Research Center Program through the Ministry of Education, Science and Technology (2010K000969).

PY - 2013/10

Y1 - 2013/10

N2 - Copper lines with widths varying from 150 to 1500 μm were deposited onto crystalline silicon wafers and soda-lime glass plates by cold spraying copper particles with 1 μm average diameter through a mask. This direct deposition method yielded high-aspect-ratio electrodes with minimum shadowing effects and maximum electrode-to-silicon contact area. The copper lines had triangular cross sections with aspect ratios (height/width) ranging from 0.1 to 1.1, depending on the number of spray gun passes. Copper particles were densely packed with increasing the width of the masking slit. This study presents the potential use of the cold spray technology in printing lines as front electrodes in solar cell applications.

AB - Copper lines with widths varying from 150 to 1500 μm were deposited onto crystalline silicon wafers and soda-lime glass plates by cold spraying copper particles with 1 μm average diameter through a mask. This direct deposition method yielded high-aspect-ratio electrodes with minimum shadowing effects and maximum electrode-to-silicon contact area. The copper lines had triangular cross sections with aspect ratios (height/width) ranging from 0.1 to 1.1, depending on the number of spray gun passes. Copper particles were densely packed with increasing the width of the masking slit. This study presents the potential use of the cold spray technology in printing lines as front electrodes in solar cell applications.

KW - coating glass

KW - cold spray

KW - copper electrode

KW - line printing

KW - solar cell

UR - http://www.scopus.com/inward/record.url?scp=84884906162&partnerID=8YFLogxK

U2 - 10.1007/s11666-013-9953-4

DO - 10.1007/s11666-013-9953-4

M3 - Article

AN - SCOPUS:84884906162

SN - 1059-9630

VL - 22

SP - 1092

EP - 1102

JO - Journal of Thermal Spray Technology

JF - Journal of Thermal Spray Technology

IS - 7

ER -

Cold spray deposition of copper electrodes on silicon and glass substrates

Abstract

Keywords

ASJC Scopus subject areas

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