Compact and thermosensitive micropump inspired by plant leaf

Hyejeong Kim, Kiwoong Kim, Sang Joon Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Liquid transportation without employing a bulky power source, often observed in nature, has been an essential prerequisite for smart applications of microfluidic devices. In this report, a leafinspired micropump (LIM) which is composed of thermoresponsive stomata inspired membrane (SIM) and mesophyllinspired agarose cryogel (MAC) is proposed. The LIM provides a durable flow rate of 30 μl/h·cm2 for more than 30 h at room temperature without external mechanical power source. By adapting a thermo-responsive polymer, the LIM can smartly adjust the delivery rate of a therapeutic liquid in response to temperature changes. In addition, as the LIM is compact, portable, and easily integrated into any liquid, it might be utilized as an essential component in advanced hand-held drug delivery devices.

Original languageEnglish
Title of host publicationSymposia
Subtitle of host publicationFluid Measurement and Instrumentation; Fluid Dynamics of Wind Energy; Renewable and Sustainable Energy Conversion; Energy and Process Engineering; Microfluidics and Nanofluidics; Development and Applications in Computational Fluid Dynamics; DNS/LES and Hybrid RANS/LES Methods
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Electronic)9780791858059
DOIs
Publication statusPublished - 2017
Externally publishedYes
EventASME 2017 Fluids Engineering Division Summer Meeting, FEDSM 2017 - Waikoloa, United States
Duration: 2017 Jul 302017 Aug 3

Publication series

NameAmerican Society of Mechanical Engineers, Fluids Engineering Division (Publication) FEDSM
Volume1B-2017
ISSN (Print)0888-8116

Conference

ConferenceASME 2017 Fluids Engineering Division Summer Meeting, FEDSM 2017
Country/TerritoryUnited States
CityWaikoloa
Period17/7/3017/8/3

Bibliographical note

Publisher Copyright:
© Copyright 2017 ASME.

ASJC Scopus subject areas

  • Mechanical Engineering

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