Contact angle evaluation for laser cleaning efficiency

J. Y. Baek, H. Jeong, M. H. Lee, J. D. Song, S. B. Kim, K. W. Lee, G. S. Kim, S. H. Kim

    Research output: Contribution to journalArticlepeer-review

    1 Citation (Scopus)

    Abstract

    A laser cleaning technique using an excimer laser is introduced to remove the photoresist on a Si wafer surface and its cleaning characteristics have been investigated. To analyse the cleaning efficiency quantitatively, a scanning electronic microscope, energy dispersive spectroscope, surface scanner and contact angle measurement were employed. Among these methods, it was confirmed experimentally that the contact angle measurement could be applicable to analyse the laser cleaning efficiency effectively owing to its speed of measurement and low measurement cost.

    Original languageEnglish
    Pages (from-to)553-554
    Number of pages2
    JournalElectronics Letters
    Volume45
    Issue number11
    DOIs
    Publication statusPublished - 2009

    ASJC Scopus subject areas

    • Electrical and Electronic Engineering

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