Contact Enhancement in Nanoparticle Assemblies through Electrophoretic Deposition

Yoonsu Park, Wooseok Jeong, Junhyuk Ahn, Yun Kun Hong, Eunseo Hwang, Minyoung Kim, Yun Jae Hwang, Soong Ju Oh, Don Hyung Ha

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1 Citation (Scopus)


A strong interparticle connection needs to be realized to harvest unique nanoscale features of colloidal nanoparticles (NPs) in film structures. Constructing a strong contact and adhesion of NPs on a substrate is an essential process for improved NP film properties, and therefore, its key factors should be determined by understanding the NP deposition mechanism. Herein, we investigated the critical factors leading to the robust and strong adherence of the film structure and revealed that the NP deposition mechanism involved the role of surfactant ligands during electrophoretic deposition (EPD). The high amount of surfactant ligand treatment results in a high deposition rate of NPs in the early stage; however, the ligand treatment does not influence the deposition rate in the later stage. Furthermore, the deposition mechanism is found to involve three steps during EPD: Island formation, lateral growth, and layer-by-layer deposition. Rapid NP deposition kinetics controlled by ligand treatments demonstrate the strong contact and adhesion of NP film structures; they are characterized by the fast charge transfer, low resistivity, and rigid NP layers of the Cu2-xS NP-based devices. Finally, the controlled role of surfactant ligands in EPD enables design of high-performance nanostructured NP film devices with contact enhancement.

Original languageEnglish
Pages (from-to)41021-41032
Number of pages12
JournalACS Omega
Issue number45
Publication statusPublished - 2022 Nov 15

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© 2022 American Chemical Society. All rights reserved.

ASJC Scopus subject areas

  • General Chemistry
  • General Chemical Engineering


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