TY - JOUR
T1 - Contact Enhancement in Nanoparticle Assemblies through Electrophoretic Deposition
AU - Park, Yoonsu
AU - Jeong, Wooseok
AU - Ahn, Junhyuk
AU - Hong, Yun Kun
AU - Hwang, Eunseo
AU - Kim, Minyoung
AU - Hwang, Yun Jae
AU - Oh, Soong Ju
AU - Ha, Don Hyung
N1 - Funding Information:
This research was supported NRF grant funded by the Ministry of Science and ICT (MSIT) (grant number: 2020R1A5A1018052). This research was supported by the Chung-Ang University Research Scholarship Grants in 2021.
Publisher Copyright:
© 2022 American Chemical Society. All rights reserved.
PY - 2022/11/15
Y1 - 2022/11/15
N2 - A strong interparticle connection needs to be realized to harvest unique nanoscale features of colloidal nanoparticles (NPs) in film structures. Constructing a strong contact and adhesion of NPs on a substrate is an essential process for improved NP film properties, and therefore, its key factors should be determined by understanding the NP deposition mechanism. Herein, we investigated the critical factors leading to the robust and strong adherence of the film structure and revealed that the NP deposition mechanism involved the role of surfactant ligands during electrophoretic deposition (EPD). The high amount of surfactant ligand treatment results in a high deposition rate of NPs in the early stage; however, the ligand treatment does not influence the deposition rate in the later stage. Furthermore, the deposition mechanism is found to involve three steps during EPD: Island formation, lateral growth, and layer-by-layer deposition. Rapid NP deposition kinetics controlled by ligand treatments demonstrate the strong contact and adhesion of NP film structures; they are characterized by the fast charge transfer, low resistivity, and rigid NP layers of the Cu2-xS NP-based devices. Finally, the controlled role of surfactant ligands in EPD enables design of high-performance nanostructured NP film devices with contact enhancement.
AB - A strong interparticle connection needs to be realized to harvest unique nanoscale features of colloidal nanoparticles (NPs) in film structures. Constructing a strong contact and adhesion of NPs on a substrate is an essential process for improved NP film properties, and therefore, its key factors should be determined by understanding the NP deposition mechanism. Herein, we investigated the critical factors leading to the robust and strong adherence of the film structure and revealed that the NP deposition mechanism involved the role of surfactant ligands during electrophoretic deposition (EPD). The high amount of surfactant ligand treatment results in a high deposition rate of NPs in the early stage; however, the ligand treatment does not influence the deposition rate in the later stage. Furthermore, the deposition mechanism is found to involve three steps during EPD: Island formation, lateral growth, and layer-by-layer deposition. Rapid NP deposition kinetics controlled by ligand treatments demonstrate the strong contact and adhesion of NP film structures; they are characterized by the fast charge transfer, low resistivity, and rigid NP layers of the Cu2-xS NP-based devices. Finally, the controlled role of surfactant ligands in EPD enables design of high-performance nanostructured NP film devices with contact enhancement.
UR - http://www.scopus.com/inward/record.url?scp=85141619953&partnerID=8YFLogxK
U2 - 10.1021/acsomega.2c04366
DO - 10.1021/acsomega.2c04366
M3 - Article
AN - SCOPUS:85141619953
SN - 2470-1343
VL - 7
SP - 41021
EP - 41032
JO - ACS Omega
JF - ACS Omega
IS - 45
ER -