Contact printing technologies for encapsulation of flexible oleds

Hakkoo Kim; Jin Hwan Choi; Young Wook Park; Tae Hyun Park; Eun Ho Song; Se Joong Shin; Hyun Jun Lee; Byeong Kwon Ju

doi:10.1002/j.2168-0159.2012.tb06027.x

Contact printing technologies for encapsulation of flexible oleds

Hakkoo Kim
, Jin Hwan Choi
, Young Wook Park
, Tae Hyun Park
, Eun Ho Song
, Se Joong Shin
, Hyun Jun Lee
, Byeong Kwon Ju^*

^*Corresponding author for this work

Research output: Contribution to journal › Conference article › peer-review

1 Citation (Scopus)

Abstract

Contact printing is an encapsulation technique, which allows printing of UV-cured resin coated on a polymer stamp (polydimethylsiloxane, which is also known as PDMS) to different surfaces. The contact printing process allows encapsulation to be layered without using sophisticated methods and solvent effect [1]. In this paper, we present the fabrication of a new encapsulation for the flexible organic light-emitting diodes (OLESs) on a plastic substrate. Our experimental results confirmed that the encapsulation, which restricted the moisture that penetrated into the devices. This method is ideally suited to the fabrication of flexible OLEDs.

Original language	English
Pages (from-to)	1258-1260
Number of pages	3
Journal	Digest of Technical Papers - SID International Symposium
Volume	43
Issue number	1
DOIs	https://doi.org/10.1002/j.2168-0159.2012.tb06027.x
Publication status	Published - 2012
Event	49th SID International Symposium, Seminar and Exhibition, dubbed Display Week, 2012 - Boston, United States Duration: 2012 Jun 3 → 2012 Jun 8

Bibliographical note

Publisher Copyright:
© 2012 SID.

ASJC Scopus subject areas

General Engineering

Access to Document

10.1002/j.2168-0159.2012.tb06027.x

Cite this

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title = "Contact printing technologies for encapsulation of flexible oleds",

abstract = "Contact printing is an encapsulation technique, which allows printing of UV-cured resin coated on a polymer stamp (polydimethylsiloxane, which is also known as PDMS) to different surfaces. The contact printing process allows encapsulation to be layered without using sophisticated methods and solvent effect [1]. In this paper, we present the fabrication of a new encapsulation for the flexible organic light-emitting diodes (OLESs) on a plastic substrate. Our experimental results confirmed that the encapsulation, which restricted the moisture that penetrated into the devices. This method is ideally suited to the fabrication of flexible OLEDs.",

author = "Hakkoo Kim and Choi, \{Jin Hwan\} and Park, \{Young Wook\} and Park, \{Tae Hyun\} and Song, \{Eun Ho\} and Shin, \{Se Joong\} and Lee, \{Hyun Jun\} and Ju, \{Byeong Kwon\}",

note = "Publisher Copyright: {\textcopyright} 2012 SID.; 49th SID International Symposium, Seminar and Exhibition, dubbed Display Week, 2012 ; Conference date: 03-06-2012 Through 08-06-2012",

year = "2012",

doi = "10.1002/j.2168-0159.2012.tb06027.x",

language = "English",

volume = "43",

pages = "1258--1260",

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TY - JOUR

T1 - Contact printing technologies for encapsulation of flexible oleds

AU - Kim, Hakkoo

AU - Choi, Jin Hwan

AU - Park, Young Wook

AU - Park, Tae Hyun

AU - Song, Eun Ho

AU - Shin, Se Joong

AU - Lee, Hyun Jun

AU - Ju, Byeong Kwon

PY - 2012

Y1 - 2012

N2 - Contact printing is an encapsulation technique, which allows printing of UV-cured resin coated on a polymer stamp (polydimethylsiloxane, which is also known as PDMS) to different surfaces. The contact printing process allows encapsulation to be layered without using sophisticated methods and solvent effect [1]. In this paper, we present the fabrication of a new encapsulation for the flexible organic light-emitting diodes (OLESs) on a plastic substrate. Our experimental results confirmed that the encapsulation, which restricted the moisture that penetrated into the devices. This method is ideally suited to the fabrication of flexible OLEDs.

AB - Contact printing is an encapsulation technique, which allows printing of UV-cured resin coated on a polymer stamp (polydimethylsiloxane, which is also known as PDMS) to different surfaces. The contact printing process allows encapsulation to be layered without using sophisticated methods and solvent effect [1]. In this paper, we present the fabrication of a new encapsulation for the flexible organic light-emitting diodes (OLESs) on a plastic substrate. Our experimental results confirmed that the encapsulation, which restricted the moisture that penetrated into the devices. This method is ideally suited to the fabrication of flexible OLEDs.

UR - https://www.scopus.com/pages/publications/85075647065

U2 - 10.1002/j.2168-0159.2012.tb06027.x

DO - 10.1002/j.2168-0159.2012.tb06027.x

M3 - Conference article

AN - SCOPUS:85075647065

SN - 0097-966X

VL - 43

SP - 1258

EP - 1260

JO - Digest of Technical Papers - SID International Symposium

JF - Digest of Technical Papers - SID International Symposium

IS - 1

T2 - 49th SID International Symposium, Seminar and Exhibition, dubbed Display Week, 2012

Y2 - 3 June 2012 through 8 June 2012

ER -

Contact printing technologies for encapsulation of flexible oleds

Abstract

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