Copper shell networks in polymer composites for efficient thermal conduction

Seunggun Yu, Jang Woo Lee, Tae Hee Han, Cheolmin Park, Youngdon Kwon, Soon Man Hong, Chong Min Koo

Research output: Contribution to journalArticlepeer-review

84 Citations (Scopus)


Thermal management of polymeric composites is a crucial issue to determine the performance and reliability of the devices. Here, we report a straightforward route to prepare polymeric composites with Cu thin film networks. Taking advantage of the fluidity of polymer melt and the ductile properties of Cu films, the polymeric composites were created by the Cu metallization of PS bead and the hot press molding of Cu-plated PS beads. The unique three-dimensional Cu shell-networks in the PS matrix demonstrated isotropic and ideal conductive performance at even extremely low Cu contents. In contrast to the conventional simple melt-mixed Cu beads/PS composites at the same concentration of 23.0 vol %, the PS composites with Cu shell networks indeed revealed 60 times larger thermal conductivity and 8 orders of magnitude larger electrical conductivity. Our strategy offers a straightforward and high-throughput route for the isotropic thermal and electrical conductive composites.

Original languageEnglish
Pages (from-to)11618-11622
Number of pages5
JournalACS Applied Materials and Interfaces
Issue number22
Publication statusPublished - 2013 Nov 27
Externally publishedYes


  • composites
  • core-shell
  • electrical conductivity
  • electroless plating
  • percolation
  • thermal conductivity

ASJC Scopus subject areas

  • Materials Science(all)


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