Copper thin films on PET prepared at ambient temperature by ECR-CVD

Hyungduk Ko; Junggeun Jhin; Dongjin Byun; Joongkee Lee; Dalkeun Park

doi:10.1109/TCAPT.2005.859670

Copper thin films on PET prepared at ambient temperature by ECR-CVD

Hyungduk Ko, Junggeun Jhin, Dongjin Byun, Joongkee Lee, Dalkeun Park

Research output: Contribution to journal › Review article › peer-review

5 Citations (Scopus)

Abstract

Metallized polymers were prepared at ambient temperature by an electron-cyclotron-resonance (ECR) chemical vapor deposition system equipped with (-)DC bias from the Cu(hfac)₂-Ar-H₂ system. X-ray difraction (XRD) results showed that the Cu (111) peaks were clearly observed when H₂ was introduced to the plasma. The surface morphology showed that larger Cu grains were formed in the metal-organic composite films with the introduction of H₂ to the plasma. AES depth profiles showed that H₂ gas introduction to the plasma led to the formation of copper-rich films with a homogeneous composition. Also, the sheet resistance was strongly dependent on the H₂ content of the plasma. This means that hydrogen may lead to both the formation of stable volatile organic compounds and the reduction of copper, which influences both the crystaliographic structure and the composition of films. As a result, crystalline copper films with a sheet resistance of 2-3 Ω ² can be prepared on poly ethylene terephthalate with the addition of H₂ to the plasma.

Original language	English
Pages (from-to)	781-784
Number of pages	4
Journal	IEEE Transactions on Components and Packaging Technologies
Volume	28
Issue number	4
DOIs	https://doi.org/10.1109/TCAPT.2005.859670
Publication status	Published - 2005 Dec

Keywords

Cu(hfac)
Electron-cyclotron-resonance chemical vapor deposition (ECR-CVD)
Plasma
Poly ethylene terephthalate (PET)
Sheet resistance

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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10.1109/TCAPT.2005.859670

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title = "Copper thin films on PET prepared at ambient temperature by ECR-CVD",

abstract = "Metallized polymers were prepared at ambient temperature by an electron-cyclotron-resonance (ECR) chemical vapor deposition system equipped with (-)DC bias from the Cu(hfac)2-Ar-H2 system. X-ray difraction (XRD) results showed that the Cu (111) peaks were clearly observed when H2 was introduced to the plasma. The surface morphology showed that larger Cu grains were formed in the metal-organic composite films with the introduction of H2 to the plasma. AES depth profiles showed that H2 gas introduction to the plasma led to the formation of copper-rich films with a homogeneous composition. Also, the sheet resistance was strongly dependent on the H2 content of the plasma. This means that hydrogen may lead to both the formation of stable volatile organic compounds and the reduction of copper, which influences both the crystaliographic structure and the composition of films. As a result, crystalline copper films with a sheet resistance of 2-3 Ω 2 can be prepared on poly ethylene terephthalate with the addition of H2 to the plasma.",

keywords = "Cu(hfac), Electron-cyclotron-resonance chemical vapor deposition (ECR-CVD), Plasma, Poly ethylene terephthalate (PET), Sheet resistance",

author = "Hyungduk Ko and Junggeun Jhin and Dongjin Byun and Joongkee Lee and Dalkeun Park",

year = "2005",

month = dec,

doi = "10.1109/TCAPT.2005.859670",

language = "English",

volume = "28",

pages = "781--784",

journal = "IEEE Transactions on Components and Packaging Technologies",

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T1 - Copper thin films on PET prepared at ambient temperature by ECR-CVD

AU - Ko, Hyungduk

AU - Jhin, Junggeun

AU - Byun, Dongjin

AU - Lee, Joongkee

AU - Park, Dalkeun

PY - 2005/12

Y1 - 2005/12

N2 - Metallized polymers were prepared at ambient temperature by an electron-cyclotron-resonance (ECR) chemical vapor deposition system equipped with (-)DC bias from the Cu(hfac)2-Ar-H2 system. X-ray difraction (XRD) results showed that the Cu (111) peaks were clearly observed when H2 was introduced to the plasma. The surface morphology showed that larger Cu grains were formed in the metal-organic composite films with the introduction of H2 to the plasma. AES depth profiles showed that H2 gas introduction to the plasma led to the formation of copper-rich films with a homogeneous composition. Also, the sheet resistance was strongly dependent on the H2 content of the plasma. This means that hydrogen may lead to both the formation of stable volatile organic compounds and the reduction of copper, which influences both the crystaliographic structure and the composition of films. As a result, crystalline copper films with a sheet resistance of 2-3 Ω 2 can be prepared on poly ethylene terephthalate with the addition of H2 to the plasma.

AB - Metallized polymers were prepared at ambient temperature by an electron-cyclotron-resonance (ECR) chemical vapor deposition system equipped with (-)DC bias from the Cu(hfac)2-Ar-H2 system. X-ray difraction (XRD) results showed that the Cu (111) peaks were clearly observed when H2 was introduced to the plasma. The surface morphology showed that larger Cu grains were formed in the metal-organic composite films with the introduction of H2 to the plasma. AES depth profiles showed that H2 gas introduction to the plasma led to the formation of copper-rich films with a homogeneous composition. Also, the sheet resistance was strongly dependent on the H2 content of the plasma. This means that hydrogen may lead to both the formation of stable volatile organic compounds and the reduction of copper, which influences both the crystaliographic structure and the composition of films. As a result, crystalline copper films with a sheet resistance of 2-3 Ω 2 can be prepared on poly ethylene terephthalate with the addition of H2 to the plasma.

KW - Cu(hfac)

KW - Electron-cyclotron-resonance chemical vapor deposition (ECR-CVD)

KW - Plasma

KW - Poly ethylene terephthalate (PET)

KW - Sheet resistance

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U2 - 10.1109/TCAPT.2005.859670

DO - 10.1109/TCAPT.2005.859670

M3 - Review article

AN - SCOPUS:29244468310

SN - 1521-3331

VL - 28

SP - 781

EP - 784

JO - IEEE Transactions on Components and Packaging Technologies

JF - IEEE Transactions on Components and Packaging Technologies

IS - 4

ER -

Copper thin films on PET prepared at ambient temperature by ECR-CVD

Abstract

Keywords

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