With the rapid advancement of 5G communication technologies, there is an urgent need to develop materials with low dielectric loss for compact and high-efficiency flexible copper clad laminates (FCCL). To address the issue of relatively high dielectric loss of the combination of a polyimide (PI) film and a bonding sheet for 5G FCCL substrate, this study investigated poly(glycidyl methacrylate)-grafted poly(ether ether ketone) (PEEK-g-PGMA), which was prepared via UV-induced self-initiated surface polymerization. The visual appearance and mechanical properties of the PEEK were maintained after the grafting process, and the thin PGMA layer was characterized using Fourier transform infrared spectroscopy (FTIR), X-ray photoelectron spectroscopy (XPS), and contact angle measurements. To optimize the processes of PGMA grafting and hot pressing, 90° peel tests were conducted. As a result, the optimized grafting and hot-press conditions were found to be UV irradiation of 4 min, 1.0 M monomer solution, and hot pressing at 180 °C for 60 min. At 28 GHz, the PEEK-g-PGMA exhibited lower dielectric constant and loss than those of the PI films with commercial bonding sheet. The study presents a straightforward approach to prepare the PEEK-g-PGMA films as a potential bonding sheet-free substrate for 5G FCCL.
|Colloids and Surfaces A: Physicochemical and Engineering Aspects
|Published - 2022 Jul 20
Bibliographical noteFunding Information:
This research was supported by the BK21 FOUR Program through the National Research Foundation of Korea funded by the Ministry of Education (Republic of Korea) ( 4199990514635 ), and the National Research Foundation of Korea (Republic of Korea) (NRF- 2020M3D1A2100818 ).
© 2022 Elsevier B.V.
- Bonding sheet-free
- Flexible copper clad laminate
- Poly(ether ether ketone)
- Surface modification
ASJC Scopus subject areas
- Surfaces and Interfaces
- Physical and Theoretical Chemistry
- Colloid and Surface Chemistry