Keyphrases
Surface Modification
100%
Low Dielectric Loss
100%
Polyetheretherketone
100%
High-frequency Applications
100%
Flexible Copper Clad Laminate
100%
UV-initiated
100%
Hot Pressing
66%
Polyimide Film
66%
High Efficiency
33%
X-ray Photoelectron Spectroscopy
33%
Mechanical Properties
33%
Fourier Transform Infrared Spectroscopy (FT-IR)
33%
Rapid Advancement
33%
Dielectric Loss
33%
UV Radiation
33%
Grafting Method
33%
Contact Angle Measurement
33%
High-k Dielectric
33%
Low Dielectric Constant
33%
Glycidyl Methacrylate
33%
Visual Appearance
33%
UV-induced
33%
Pressing Conditions
33%
Peel Test
33%
Self-initiated
33%
Laminate Substrate
33%
Surface-initiated Polymerization
33%
Appearance Properties
33%
5G Communication Technology
33%
Material Science
Surface Treatment
100%
Polyetheretherketone
100%
Dielectric Material
100%
Film
50%
Polyimide
33%
Hot Pressing
33%
X-Ray Photoelectron Spectroscopy
16%
Permittivity
16%
Fourier Transform Infrared Spectroscopy
16%
Polymerization
16%
Contact Angle
16%
Surface (Surface Science)
16%