Abstract
As dynamic random access memory (DRAM) technology continues to scale down, DRAM vendors have adopted on-die error correction codes (on-die ECC) to address reliability problems caused by cell failures. For burst error correction, a single symbol correction (SSC) Reed-Solomon (RS) code is utilized in high bandwidth memory (HBM) 3. However, randomly scattered errors frequently occur with aggressive technology scaling, which necessitates more robust error correction codes (ECC) scheme that addresses both burst errors and scattered errors. This brief presents double bit and burst ECC (DBB-ECC), an efficient scheme designed to correct both single symbol errors and random double bit errors with reduced implementation overhead. In the proposed decoding, syndromes based on SSC RS codes are used to address both error types without increasing parity bits. The decoder complexity has been also reduced by exploiting the syndrome patterns of double bit errors. The experimental results show that the proposed solution needs lower implementation overhead than conventional ones while maintaining same level of correction capability. Compared to the conventional SSC code, it also significantly enhances HBM3 reliability without increasing storage overhead.
| Original language | English |
|---|---|
| Pages (from-to) | 3236-3240 |
| Number of pages | 5 |
| Journal | IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems |
| Volume | 44 |
| Issue number | 8 |
| DOIs | |
| Publication status | Published - 2025 |
Bibliographical note
Publisher Copyright:© 1982-2012 IEEE.
Keywords
- Double error correction (DEC)
- Reed-Solomon (RS) codes
- error correction codes (ECC)
- high bandwidth memory (HBM)
- on-die error correction codes (on-die ECC)
- single symbol correction (SSC)
ASJC Scopus subject areas
- Software
- Computer Graphics and Computer-Aided Design
- Electrical and Electronic Engineering
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