Dependence on proton energy of degradation of AlGaN/GaN high electron mobility transistors

Lu Liu, Chien Fong Lo, Yuyin Xi, Yuxi Wang, Fan Ren, Stephen J. Pearton, Hong Yeol Kim, Jihyun Kim, Robert C. Fitch, Dennis E. Walker, Kelson D. Chabak, James K. Gillespie, Stephen E. Tetlak, Glen D. Via, Antonio Crespo, Ivan I. Kravchenko

Research output: Contribution to journalArticlepeer-review

40 Citations (Scopus)


The effects of proton irradiation energy on dc, small signal, and large signal rf characteristics of AlGaN/GaN high electron mobility transistors (HEMTs) were investigated. AlGaN/GaN HEMTs were irradiated with protons at fixed fluence of 5 × 1015/cm2 and energies of 5, 10, and 15 MeV. Both dc and rf characteristics revealed more degradation at lower irradiation energy, with reductions of maximum transconductance of 11, 22, and 38, and decreases in drain saturation current of 10, 24, and 46 for HEMTs exposed to 15, 10, and 5 MeV protons, respectively. The increase in device degradation with decreasing proton energy is due to the increase in linear energy transfer and corresponding increase in nonionizing energy loss with decreasing proton energy in the active region of the HEMTs. After irradiation, both subthreshold drain leakage current and reverse gate current decreased more than 1 order of magnitude for all samples. The carrier removal rate was in the range 121-336 cm-1 over the range of proton energies employed in this study.

Original languageEnglish
Article number022201
JournalJournal of Vacuum Science and Technology B:Nanotechnology and Microelectronics
Issue number2
Publication statusPublished - 2013 Mar

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Process Chemistry and Technology
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering
  • Materials Chemistry


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