Depth-selective imaging of macroscopic objects hidden behind a scattering layer using low-coherence and wide-field interferometry

Sungsoo Woo, Sungsam Kang, Changhyeong Yoon, Hakseok Ko, Wonshik Choi

    Research output: Contribution to journalArticlepeer-review

    6 Citations (Scopus)

    Abstract

    Imaging systems targeting macroscopic objects tend to have poor depth selectivity. In this Letter, we present a 3D imaging system featuring a depth resolution of 200 μm, depth scanning range of more than 1 m, and view field larger than 70×70 mm2. For depth selectivity, we set up an off-axis digital holographic imaging system using a light source with a coherence length of 400 μm. A prism pair was installed in the reference beam path for long-range depth scanning. We performed imaging macroscopic targets with multiple different layers and also demonstrated imaging targets hidden behind a scattering layer.

    Original languageEnglish
    Pages (from-to)210-214
    Number of pages5
    JournalOptics Communications
    Volume372
    DOIs
    Publication statusPublished - 2016 Aug 1

    Bibliographical note

    Funding Information:
    This research was supported by the IT R&D Program ( R2013080003 ); the Global Frontier Program ( 2014M3A6B3063710 ); IBS-R023-D1 ; the Basic Science Research Program ( 2013R1A1A2062560 ); the Nano-Material Technology Development Program ( 2011-0020205 ) through the National Research Foundation of Korea (NRF) funded by the Ministry of Science, ICT and Future Planning . It was also supported by the Korea Health Technology R&D Project ( HI14C0748 ) funded by the Ministry of Health and Welfare , Republic of Korea.

    Publisher Copyright:
    © 2016 Elsevier B.V. All rights reserved.

    Keywords

    • Imaging systems
    • Imaging through turbid media
    • Interferometric imaging
    • Speckle imaging

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Atomic and Molecular Physics, and Optics
    • Physical and Theoretical Chemistry
    • Electrical and Electronic Engineering

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