Design of HTS modular magnets for a 2.5 MJ toroidal SMES: ReBCO vs. BSCCO

Seyeon Lee, Woo Seok Kim, Sang Ho Park, Ji Kwang Lee, Chan Park, Joon Han Bae, Ki Chul Seong, Haigun Lee, Jong Hoon Lee, Kyeongdal Choi, Songyop Hahn

Research output: Contribution to journalArticlepeer-review

12 Citations (Scopus)


A 2.5 MJ HTS SMES is being developed as a national program in Korea. This paper presents design results of modular HTS magnets for the 2.5 MJ toroidal SMES. We considered a choice of BSCCO-2223 or ReBCO tapes as the conductors for the HTS magnets of the SMES. Operating temperature was decided to be 20 K which could be accomplished by conduction cooling with a couple of GM cryo-coolers. Key design factors may include minimization of total conductor requirement and low AC loss.

Original languageEnglish
Article number5438851
Pages (from-to)1324-1328
Number of pages5
JournalIEEE Transactions on Applied Superconductivity
Issue number3
Publication statusPublished - 2010 Jun

Bibliographical note

Funding Information:
Manuscript received October 20, 2009. First published March 25, 2010; current version published May 28, 2010. This work was supported by Electric Power Industry Technology Evaluation and Planning, Korea. Seyeon Lee, Sang Ho Park, and Kyeongdal Choi are with Korea Polytechnic University, Shiheung, Korea (e-mail: Woo-Seok Kim and Chan Park are with the Department of Materials Science & Engineering, Seoul National University, Seoul, Korea (e-mail: Ji-Kwang Lee is with Woosuk University, Wanju, Chunbuk, Korea. Joon-han Bae and Ki-chul Seong are with Korea Electrotechnology Research Institute, Changwon, Korea. Haigun Lee and Jong-Hoon Lee are with Korea University, Seoul, Korea. Songyop Hahn is with the Electrical Engineering and Science Research Institute, Seoul, Korea. Digital Object Identifier 10.1109/TASC.2010.2041543


  • HTS magnet
  • Magnetization loss
  • SMES
  • Toroidal magnet

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering


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