TY - GEN
T1 - Differential-to-common mode conversion noise suppression with unit cell EBG structure for bended differential lines
AU - Oh, Sangyeol
AU - Shin, Beomsoo
AU - Lim, Jaehyuk
AU - Lee, Seungjin
AU - Lee, Jaehoon
N1 - Publisher Copyright:
© 2016 IEEE.
Copyright:
Copyright 2017 Elsevier B.V., All rights reserved.
PY - 2017/4/5
Y1 - 2017/4/5
N2 - In order to reduce differential-to-common mode conversion noise in bended differential lines, we propose a unit cell electromagnetic bandgap (EBG) structure. The proposed structure compensates for mismatches of inductances and capacitances between inner and outer lines of the bended differential lines. Its performances of the common-mode noise suppression in frequency and time domains were verified by 3D full wave simulator, HFSS. Also, in order to verify the simulated results, the bended differential lines with the proposed unit cell EBG structure was fabricated and measured. As a result, suppression level of the differential-to-common mode conversion noise is below -20 dB from DC to 6 GHz, and Time-Domain-Through (TDT) common-mode noise voltage is reduced as compared with that of conventional bended differential lines.
AB - In order to reduce differential-to-common mode conversion noise in bended differential lines, we propose a unit cell electromagnetic bandgap (EBG) structure. The proposed structure compensates for mismatches of inductances and capacitances between inner and outer lines of the bended differential lines. Its performances of the common-mode noise suppression in frequency and time domains were verified by 3D full wave simulator, HFSS. Also, in order to verify the simulated results, the bended differential lines with the proposed unit cell EBG structure was fabricated and measured. As a result, suppression level of the differential-to-common mode conversion noise is below -20 dB from DC to 6 GHz, and Time-Domain-Through (TDT) common-mode noise voltage is reduced as compared with that of conventional bended differential lines.
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U2 - 10.1109/EDAPS.2016.7893137
DO - 10.1109/EDAPS.2016.7893137
M3 - Conference contribution
AN - SCOPUS:85018388777
T3 - 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016
SP - 103
EP - 105
BT - 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016
Y2 - 14 December 2016 through 16 December 2016
ER -