Abstract
In order to reduce differential-to-common mode conversion noise in bended differential lines, we propose a unit cell electromagnetic bandgap (EBG) structure. The proposed structure compensates for mismatches of inductances and capacitances between inner and outer lines of the bended differential lines. Its performances of the common-mode noise suppression in frequency and time domains were verified by 3D full wave simulator, HFSS. Also, in order to verify the simulated results, the bended differential lines with the proposed unit cell EBG structure was fabricated and measured. As a result, suppression level of the differential-to-common mode conversion noise is below -20 dB from DC to 6 GHz, and Time-Domain-Through (TDT) common-mode noise voltage is reduced as compared with that of conventional bended differential lines.
| Original language | English |
|---|---|
| Title of host publication | 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 103-105 |
| Number of pages | 3 |
| ISBN (Electronic) | 9781509061846 |
| DOIs | |
| Publication status | Published - 2017 Apr 5 |
| Event | 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016 - Honolulu, United States Duration: 2016 Dec 14 → 2016 Dec 16 |
Publication series
| Name | 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016 |
|---|
Other
| Other | 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016 |
|---|---|
| Country/Territory | United States |
| City | Honolulu |
| Period | 16/12/14 → 16/12/16 |
Bibliographical note
Publisher Copyright:© 2016 IEEE.
Copyright:
Copyright 2017 Elsevier B.V., All rights reserved.
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
- Modelling and Simulation