Dynamic deadband control in semiconductor manufacturing

This paper proposes efficient control method to minimize process error and to reduce process variance in semiconductor manufacturing. Photo-lithography process make more detailed complex circuit in semiconductor process and is important for quality. However, obstacles were in the process of the facility itself, vibration, wear and tear, and product and process change and environmental impact are difficult to control. In addition, the existing process that is being used for a series of statistical techniques to control the problem was amplified for the change. Therefore, this paper propose effective process control method for reducing process variance by reducing the unnecessary obstacles, quickly detecting changes in the fair, and accurately reflect the degree of change. This study proposes the dynamic deadband control that has a region (band) to detect the status of a process of change and, according to detect changes in the region itself moves the process control. In this research, the semiconductor manufacturing company is supported to perform a more precise control and reduction of fluctuations due to be producing products of uniform quality. Also it can contribute to yield due to the quality incensement, and more and more minted the process control in semiconductor.