Abstract
Silver (Ag) metal electrode having 20 μm channel length was printed by reverse offset printing (ROP) using nano-silver paste ink for the source/drain of organic thin-film transistors (OTFT). Specific resistance and surface roughness of printed Ag electrodes with increasing curing temperature were investigated, and surface morphology and grain growth mechanism were systematically verified using a scanning electron microscope (SEM) and atomic force microscope (AFM) in order to obtain an optimized ROP Ag electrode. The Ag electrode was applied to fabricate top-gate/bottomcontact poly(3-hexylthiophene) OTFT devices, which showed reproducible OTFT characteristics such as the field-effect mobility, threshold voltage, and an on/off-current ratio of ∼10∼ 3 cm 2/Vs, 0.36 V, and ∼10 2, respectively.
Original language | English |
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Pages (from-to) | 3272-3275 |
Number of pages | 4 |
Journal | Journal of Nanoscience and Nanotechnology |
Volume | 12 |
Issue number | 4 |
DOIs | |
Publication status | Published - 2012 |
Keywords
- Curing temperature
- Nano-silver paste
- OTFT
- Reverse offset printing
ASJC Scopus subject areas
- Bioengineering
- General Chemistry
- Biomedical Engineering
- General Materials Science
- Condensed Matter Physics