Effect of curing temperature on nano-silver paste ink for organic thin-film transistors

Minseok Kim, Jae Bon Koo, Kang Jun Baeg, Yong Young Noh, Yong Suk Yang, Soon Won Jung, Byeong Kwon Ju, In Kyu You

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)


Silver (Ag) metal electrode having 20 μm channel length was printed by reverse offset printing (ROP) using nano-silver paste ink for the source/drain of organic thin-film transistors (OTFT). Specific resistance and surface roughness of printed Ag electrodes with increasing curing temperature were investigated, and surface morphology and grain growth mechanism were systematically verified using a scanning electron microscope (SEM) and atomic force microscope (AFM) in order to obtain an optimized ROP Ag electrode. The Ag electrode was applied to fabricate top-gate/bottomcontact poly(3-hexylthiophene) OTFT devices, which showed reproducible OTFT characteristics such as the field-effect mobility, threshold voltage, and an on/off-current ratio of ∼10∼ 3 cm 2/Vs, 0.36 V, and ∼10 2, respectively.

Original languageEnglish
Pages (from-to)3272-3275
Number of pages4
JournalJournal of Nanoscience and Nanotechnology
Issue number4
Publication statusPublished - 2012


  • Curing temperature
  • Nano-silver paste
  • OTFT
  • Reverse offset printing

ASJC Scopus subject areas

  • Bioengineering
  • General Chemistry
  • Biomedical Engineering
  • General Materials Science
  • Condensed Matter Physics


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