Effect of curing temperature on the adhesion strength of polyamideimide/copper joints

J. H. Cho, D. I. Kong, C. E. Park, M. Y. Jin

Research output: Contribution to journalArticlepeer-review

13 Citations (Scopus)


The adhesion strength of polyamideimide (PAI)/copper joints was investigated as a function of the curing temperature and time. The adhesion strength decreased as the thermal stress increased with the increase of both curing temperature and time. The effects of copper oxide formed bythermal treatment and alkaline treatment on the adhesion strength of PAI/copper joints were examined. The adhesion strength decreased with thermally oxidized copper and increased with alkali-oxidized copper. The locus of failure of PAI/copper joints was also studied by scanning electron microscopy(SEM) and X-ray photoelectron spectroscopy (XPS). The locus of failure appears to be partially cohesive in both PAI and copper oxide.

Original languageEnglish
Pages (from-to)507-521
Number of pages15
JournalJournal of Adhesion Science and Technology
Issue number5
Publication statusPublished - 1998 Jan 1
Externally publishedYes

Bibliographical note

Funding Information:
This work was supported by the Korea Research Institute of Chemical and partially supported by the Center for Advanced Functional


  • Adhesion strength
  • Copper
  • Copper oxide
  • Polyamideimide (PAI)
  • Thermal stress

ASJC Scopus subject areas

  • General Chemistry
  • Mechanics of Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry


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