Effect of curing temperature on the adhesion strength of polyamideimide/copper joints

J. H. Cho; D. I. Kong; C. E. Park; M. Y. Jin

doi:10.1163/156856198X00191

Effect of curing temperature on the adhesion strength of polyamideimide/copper joints

J. H. Cho, D. I. Kong, C. E. Park, M. Y. Jin

Research output: Contribution to journal › Article › peer-review

12 Citations (Scopus)

Abstract

The adhesion strength of polyamideimide (PAI)/copper joints was investigated as a function of the curing temperature and time. The adhesion strength decreased as the thermal stress increased with the increase of both curing temperature and time. The effects of copper oxide formed bythermal treatment and alkaline treatment on the adhesion strength of PAI/copper joints were examined. The adhesion strength decreased with thermally oxidized copper and increased with alkali-oxidized copper. The locus of failure of PAI/copper joints was also studied by scanning electron microscopy(SEM) and X-ray photoelectron spectroscopy (XPS). The locus of failure appears to be partially cohesive in both PAI and copper oxide.

Original language	English
Pages (from-to)	507-521
Number of pages	15
Journal	Journal of Adhesion Science and Technology
Volume	12
Issue number	5
DOIs	https://doi.org/10.1163/156856198X00191
Publication status	Published - 1998 Jan 1
Externally published	Yes

Keywords

Adhesion strength
Copper
Copper oxide
Polyamideimide (PAI)
Thermal stress

ASJC Scopus subject areas

Chemistry(all)
Mechanics of Materials
Surfaces and Interfaces
Surfaces, Coatings and Films
Materials Chemistry

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10.1163/156856198X00191

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title = "Effect of curing temperature on the adhesion strength of polyamideimide/copper joints",

abstract = "The adhesion strength of polyamideimide (PAI)/copper joints was investigated as a function of the curing temperature and time. The adhesion strength decreased as the thermal stress increased with the increase of both curing temperature and time. The effects of copper oxide formed bythermal treatment and alkaline treatment on the adhesion strength of PAI/copper joints were examined. The adhesion strength decreased with thermally oxidized copper and increased with alkali-oxidized copper. The locus of failure of PAI/copper joints was also studied by scanning electron microscopy(SEM) and X-ray photoelectron spectroscopy (XPS). The locus of failure appears to be partially cohesive in both PAI and copper oxide.",

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author = "Cho, {J. H.} and Kong, {D. I.} and Park, {C. E.} and Jin, {M. Y.}",

note = "Funding Information: This work was supported by the Korea Research Institute of Chemical and partially supported by the Center for Advanced Functional",

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T1 - Effect of curing temperature on the adhesion strength of polyamideimide/copper joints

AU - Cho, J. H.

AU - Kong, D. I.

AU - Park, C. E.

AU - Jin, M. Y.

N1 - Funding Information: This work was supported by the Korea Research Institute of Chemical and partially supported by the Center for Advanced Functional

PY - 1998/1/1

Y1 - 1998/1/1

N2 - The adhesion strength of polyamideimide (PAI)/copper joints was investigated as a function of the curing temperature and time. The adhesion strength decreased as the thermal stress increased with the increase of both curing temperature and time. The effects of copper oxide formed bythermal treatment and alkaline treatment on the adhesion strength of PAI/copper joints were examined. The adhesion strength decreased with thermally oxidized copper and increased with alkali-oxidized copper. The locus of failure of PAI/copper joints was also studied by scanning electron microscopy(SEM) and X-ray photoelectron spectroscopy (XPS). The locus of failure appears to be partially cohesive in both PAI and copper oxide.

AB - The adhesion strength of polyamideimide (PAI)/copper joints was investigated as a function of the curing temperature and time. The adhesion strength decreased as the thermal stress increased with the increase of both curing temperature and time. The effects of copper oxide formed bythermal treatment and alkaline treatment on the adhesion strength of PAI/copper joints were examined. The adhesion strength decreased with thermally oxidized copper and increased with alkali-oxidized copper. The locus of failure of PAI/copper joints was also studied by scanning electron microscopy(SEM) and X-ray photoelectron spectroscopy (XPS). The locus of failure appears to be partially cohesive in both PAI and copper oxide.

KW - Adhesion strength

KW - Copper

KW - Copper oxide

KW - Polyamideimide (PAI)

KW - Thermal stress

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DO - 10.1163/156856198X00191

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JO - Journal of Adhesion Science and Technology

JF - Journal of Adhesion Science and Technology

IS - 5

ER -

Effect of curing temperature on the adhesion strength of polyamideimide/copper joints

Abstract

Keywords

ASJC Scopus subject areas

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