Abstract
The adhesion strength of polyamideimide (PAI)/copper joints was investigated as a function of the curing temperature and time. The adhesion strength decreased as the thermal stress increased with the increase of both curing temperature and time. The effects of copper oxide formed bythermal treatment and alkaline treatment on the adhesion strength of PAI/copper joints were examined. The adhesion strength decreased with thermally oxidized copper and increased with alkali-oxidized copper. The locus of failure of PAI/copper joints was also studied by scanning electron microscopy(SEM) and X-ray photoelectron spectroscopy (XPS). The locus of failure appears to be partially cohesive in both PAI and copper oxide.
| Original language | English |
|---|---|
| Pages (from-to) | 507-521 |
| Number of pages | 15 |
| Journal | Journal of Adhesion Science and Technology |
| Volume | 12 |
| Issue number | 5 |
| DOIs | |
| Publication status | Published - 1998 Jan 1 |
| Externally published | Yes |
Bibliographical note
Funding Information:This work was supported by the Korea Research Institute of Chemical and partially supported by the Center for Advanced Functional
Keywords
- Adhesion strength
- Copper
- Copper oxide
- Polyamideimide (PAI)
- Thermal stress
ASJC Scopus subject areas
- General Chemistry
- Mechanics of Materials
- Surfaces and Interfaces
- Surfaces, Coatings and Films
- Materials Chemistry