Effect of displacement and humidity on contact resistance of copper electrical contacts

I. H. Sung, J. W. Kim, H. J. Noh, Ho Jang

    Research output: Contribution to journalArticlepeer-review

    60 Citations (Scopus)

    Abstract

    The effect of displacement and humidity on fretting-induced instability of electrical contact resistance (Rc) was studied. A fretting tester was used to examine Rc in partial and gross slip modes. Under the partial slip regime the contact failure was susceptible to the displacement and moisture effectively increased contact stability, which was pronounced at smaller displacements. In the gross slip mode, however, humidity effect was relatively small. The early contact failure at low humidity was attributed to the wear debris agglomeration within the sliding interface, suggesting a high propensity of electrical contact failure at dry conditions.

    Original languageEnglish
    Pages (from-to)256-261
    Number of pages6
    JournalTribology International
    Volume95
    DOIs
    Publication statusPublished - 2016 Mar 1

    Keywords

    • Contact area
    • Contact resistance
    • Fretting
    • Humidity

    ASJC Scopus subject areas

    • Mechanical Engineering
    • Mechanics of Materials
    • Surfaces, Coatings and Films
    • Surfaces and Interfaces

    Fingerprint

    Dive into the research topics of 'Effect of displacement and humidity on contact resistance of copper electrical contacts'. Together they form a unique fingerprint.

    Cite this