Effect of grain size on the electrical failure of copper contacts in fretting motion

H. J. Noh, J. W. Kim, S. M. Lee, H. Jang

    Research output: Contribution to journalArticlepeer-review

    26 Citations (Scopus)

    Abstract

    The influence of grain size on degradation of electrical contacts during fretting wear was investigated. Copper polycrystals with grain sizes of 2–162 µm were used to examine friction, wear, and electrical contact resistance. The results showed that the electrical contact failure was caused by the compact oxide layer produced at the contact junction. Copper specimens with smaller grains had a longer lifecycle because of grain-size strengthening. However, this strengthening effect was limited to a critical grain size and, with further increase in grain size, plastic deformation underneath the contact surface played a major role in delaying the contact failure caused by oxide formation on the fretting surface.

    Original languageEnglish
    Pages (from-to)39-45
    Number of pages7
    JournalTribology International
    Volume111
    DOIs
    Publication statusPublished - 2017

    Bibliographical note

    Publisher Copyright:
    © 2017 Elsevier Ltd

    Keywords

    • Electrical contacts
    • Fretting corrosion
    • Fretting wear
    • Grain size

    ASJC Scopus subject areas

    • Mechanics of Materials
    • Mechanical Engineering
    • Surfaces and Interfaces
    • Surfaces, Coatings and Films

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