Effect of moisture in a vacuum chamber on the deposition of c-BN thin film using an unbalanced magnetron sputtering method

Keyphrases

• Magnetron Sputtering Deposition 100%
• Unbalanced Magnetron Sputtering 100%
• Cubic Boron Nitride (c-BN) 100%
• Nitride Films 100%
• Vacuum Chamber 100%
• Moisture Effect 100%
• Moisture 50%
• Deposition Chamber 50%
• Plasma Treatment 50%
• H-BN Films 50%
• Chamber Wall 50%
• Single Crystal 25%
• Mixed Gas 25%
• Radio Frequency 25%
• Electric Power 25%
• Si Wafer 25%
• Deposition Conditions 25%
• Power Source 25%
• Deposition Pressure 25%
• Substrate Holder 25%
• Sputtering Target 25%
• Moisture Level 25%
• Nitride Phase 25%
• Heating Effect 25%
• Time Duration 25%
• Hexagonal Boron Nitride (h-BN) 25%
• Evacuation Time 25%
• Pre-deposition 25%
• High-frequency Power Supply 25%

Engineering

• Thin Films 100%
• Magnetron 100%
• Cubic Boron Nitride 100%
• Plasma Treatment 50%
• Chamber Wall 50%
• Power Supply 25%
• Si Wafer 25%
• Deposition Condition 25%
• Nitride 25%
• Power Source 25%
• Initial Stage 25%
• Sputter Target 25%
• Duration Time 25%

Chemical Engineering

• Magnetron Sputtering 100%
• Cubic Boron Nitride 100%
• Film 100%
• Boron Nitride 25%