Effect of oxygen plasma treatment on anodic bonding

Seung Woo Choi, Woo Beom Choi, Yun Hi Lee, Byeong Kwon Ju, Byong Ho Kim

    Research output: Contribution to journalArticlepeer-review

    14 Citations (Scopus)

    Abstract

    Oxygen plasma surface treatment of silicon and glass was studied for improving the characteristics of anodic bonding. By using the sessile drop method, we confirmed that the surfaces activated by the oxygen plasma were rendered hydrophilic even at low r.f. power or short plasma exposure time. With increasing plasma power and exposure time the surface roughness was observed to increase. The oxygen plasma treatment was significantly efficient in reducing the impurities on the surface, which caused degradation in the bonding strength and the electrical property in interface. In the tensile test, the oxygen plasma treatment led to a higher bonding strength than the conventional anodic bonding method.

    Original languageEnglish
    Pages (from-to)207-209
    Number of pages3
    JournalJournal of the Korean Physical Society
    Volume38
    Issue number3
    Publication statusPublished - 2001 Mar

    ASJC Scopus subject areas

    • General Physics and Astronomy

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