Effect of the Properties of Uniformly Patterned Micro-Diamond Pellets on Sapphire Grinding

Joong Cheul Yun, Byung young Wang, Eung seok Lee, Choong hyun Lee, Young kyun Lim, Dae Soon Lim, Han Gyoung Cho

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)


If nanoscale roughness of machined surfaces is to be achieved, a machining method using a ductile grinding mode is required. If this using a diamond tool is to be realized, uniform patterned micro-diamond pellets must be produced on the tool surface. In this study, uniform patterned micro-diamond pellets were fabricated by using Lithographie Galvanoformung Abformung (LIGA) technology combined with electroplating technology. The effect of the size of the patterned diamond pellet on sapphire wafer grinding was analyzed using a scanning electron microscope and a surface profiler after grinding. As a result, Ø12 uniformly patterned micro-diamond pellets were fabricated, and a sapphire substrate was ground to obtain a surface roughness (Ra) of 5 nm or less.

Original languageEnglish
Pages (from-to)871-876
Number of pages6
JournalJournal of the Korean Physical Society
Issue number7
Publication statusPublished - 2018 Oct 1

Bibliographical note

Funding Information:
This work was supported by the Technology Innovation Program (10052882, Development of High Throughput Wafering Equipments for Manufacturing of Transparent Sapphire Substrate with Total Kerf Loss of 300 μm or Less) funded by the Ministry of Trade, Industry and Energy (MI, Korea).

Publisher Copyright:
© 2018, The Korean Physical Society.


  • LIGA
  • Removal
  • Sapphire grinding
  • Surface roughness
  • Uniformly patterned micro-diamond

ASJC Scopus subject areas

  • General Physics and Astronomy


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