Effect of the Properties of Uniformly Patterned Micro-Diamond Pellets on Sapphire Grinding

Joong Cheul Yun; Byung young Wang; Eung seok Lee; Choong hyun Lee; Young kyun Lim; Dae Soon Lim; Han Gyoung Cho

doi:10.3938/jkps.73.871

Effect of the Properties of Uniformly Patterned Micro-Diamond Pellets on Sapphire Grinding

Joong Cheul Yun, Byung young Wang, Eung seok Lee, Choong hyun Lee, Young kyun Lim, Dae Soon Lim, Han Gyoung Cho

Research output: Contribution to journal › Article › peer-review

6 Citations (Scopus)

Abstract

If nanoscale roughness of machined surfaces is to be achieved, a machining method using a ductile grinding mode is required. If this using a diamond tool is to be realized, uniform patterned micro-diamond pellets must be produced on the tool surface. In this study, uniform patterned micro-diamond pellets were fabricated by using Lithographie Galvanoformung Abformung (LIGA) technology combined with electroplating technology. The effect of the size of the patterned diamond pellet on sapphire wafer grinding was analyzed using a scanning electron microscope and a surface profiler after grinding. As a result, Ø12 uniformly patterned micro-diamond pellets were fabricated, and a sapphire substrate was ground to obtain a surface roughness (Ra) of 5 nm or less.

Original language	English
Pages (from-to)	871-876
Number of pages	6
Journal	Journal of the Korean Physical Society
Volume	73
Issue number	7
DOIs	https://doi.org/10.3938/jkps.73.871
Publication status	Published - 2018 Oct 1

Bibliographical note

Funding Information:
This work was supported by the Technology Innovation Program (10052882, Development of High Throughput Wafering Equipments for Manufacturing of Transparent Sapphire Substrate with Total Kerf Loss of 300 μm or Less) funded by the Ministry of Trade, Industry and Energy (MI, Korea).

Publisher Copyright:
© 2018, The Korean Physical Society.

Keywords

LIGA
Removal
Sapphire grinding
Surface roughness
Uniformly patterned micro-diamond

ASJC Scopus subject areas

General Physics and Astronomy

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10.3938/jkps.73.871

Cite this

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title = "Effect of the Properties of Uniformly Patterned Micro-Diamond Pellets on Sapphire Grinding",

abstract = "If nanoscale roughness of machined surfaces is to be achieved, a machining method using a ductile grinding mode is required. If this using a diamond tool is to be realized, uniform patterned micro-diamond pellets must be produced on the tool surface. In this study, uniform patterned micro-diamond pellets were fabricated by using Lithographie Galvanoformung Abformung (LIGA) technology combined with electroplating technology. The effect of the size of the patterned diamond pellet on sapphire wafer grinding was analyzed using a scanning electron microscope and a surface profiler after grinding. As a result, {\O}12 uniformly patterned micro-diamond pellets were fabricated, and a sapphire substrate was ground to obtain a surface roughness (Ra) of 5 nm or less.",

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note = "Funding Information: This work was supported by the Technology Innovation Program (10052882, Development of High Throughput Wafering Equipments for Manufacturing of Transparent Sapphire Substrate with Total Kerf Loss of 300 μm or Less) funded by the Ministry of Trade, Industry and Energy (MI, Korea). Publisher Copyright: {\textcopyright} 2018, The Korean Physical Society.",

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AU - Yun, Joong Cheul

AU - Wang, Byung young

AU - Lee, Eung seok

AU - Lee, Choong hyun

AU - Lim, Young kyun

AU - Lim, Dae Soon

AU - Cho, Han Gyoung

N1 - Funding Information: This work was supported by the Technology Innovation Program (10052882, Development of High Throughput Wafering Equipments for Manufacturing of Transparent Sapphire Substrate with Total Kerf Loss of 300 μm or Less) funded by the Ministry of Trade, Industry and Energy (MI, Korea). Publisher Copyright: © 2018, The Korean Physical Society.

PY - 2018/10/1

Y1 - 2018/10/1

N2 - If nanoscale roughness of machined surfaces is to be achieved, a machining method using a ductile grinding mode is required. If this using a diamond tool is to be realized, uniform patterned micro-diamond pellets must be produced on the tool surface. In this study, uniform patterned micro-diamond pellets were fabricated by using Lithographie Galvanoformung Abformung (LIGA) technology combined with electroplating technology. The effect of the size of the patterned diamond pellet on sapphire wafer grinding was analyzed using a scanning electron microscope and a surface profiler after grinding. As a result, Ø12 uniformly patterned micro-diamond pellets were fabricated, and a sapphire substrate was ground to obtain a surface roughness (Ra) of 5 nm or less.

AB - If nanoscale roughness of machined surfaces is to be achieved, a machining method using a ductile grinding mode is required. If this using a diamond tool is to be realized, uniform patterned micro-diamond pellets must be produced on the tool surface. In this study, uniform patterned micro-diamond pellets were fabricated by using Lithographie Galvanoformung Abformung (LIGA) technology combined with electroplating technology. The effect of the size of the patterned diamond pellet on sapphire wafer grinding was analyzed using a scanning electron microscope and a surface profiler after grinding. As a result, Ø12 uniformly patterned micro-diamond pellets were fabricated, and a sapphire substrate was ground to obtain a surface roughness (Ra) of 5 nm or less.

KW - LIGA

KW - Removal

KW - Sapphire grinding

KW - Surface roughness

KW - Uniformly patterned micro-diamond

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Effect of the Properties of Uniformly Patterned Micro-Diamond Pellets on Sapphire Grinding

Abstract

Bibliographical note

Keywords

ASJC Scopus subject areas

Access to Document

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