Abstract
This paper presents a study of the anodic bonding technique using a hydrophilic surface. Our method differs from conventional processes in the pre-treatment of the wafer. Hydrophilic surfaces were achieved from dipping in H2O/H2O2/NH4OH solution. The hydrophilic surface has a large number of -OH groups, which can form hydrogen bonds when two wafers are in contact. This induces a higher electrostatic force, because of the decreasing gap between the glass and silicon wafer. We achieved improved properties, such as a wider bonded area and a higher bond strength than those of conventional methods. Also, the fabricated pressure sensors on the 5-inch silicon wafer were bonded to Pyrex #7740 glass of 3 mm thickness. In order to investigate the migration of the sodium ions, the depth profile at the glass surface by secondary-ion mass spectroscopy and the bonding current were compared with that of conventional methods.
Original language | English |
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Pages (from-to) | 313-318 |
Number of pages | 6 |
Journal | Journal of Micromechanics and Microengineering |
Volume | 9 |
Issue number | 4 |
DOIs | |
Publication status | Published - 1999 Dec |
Externally published | Yes |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Mechanics of Materials
- Mechanical Engineering
- Electrical and Electronic Engineering