Effects of Cu substrate morphology and phase control on electrochemical performance of Sn-Ni alloys for Li-ion battery

  • Na Ry Shin
  • , Yong Mook Kang*
  • , Min Sang Song
  • , Dong Yung Kim
  • , Hyuk Sang Kwon
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

53 Citations (Scopus)

Abstract

The influence of substrate morphology and ageing on the charge-discharge performance of a Sn-Ni alloy anode electrodeposited on a Cu substrate are examined. The Sn-Ni alloy (Sn 82 at.%-Ni 18 at.% anode) shows a high capacity of around 480 mAh g-1 up to 12 cycles, but its capacity rapidly fades with cycling. The initial capacity and the cyclic properties of the alloy electrode are significantly improved when the surface morphology of the Cu substrate is changed from smooth-type to nodule-type. Optimized ageing treatment leads to further enhancement in the charge-discharge performance of the anode. The increase in the capacity and better cyclic properties are attributed to stronger adhesion between the Si-Ni anode and the Cu substrate. This is induced by inter-locking of the nodule-type Cu substrate and a buffering effect of Cu-Sn intermetallic compounds formed during ageing.

Original languageEnglish
Pages (from-to)201-205
Number of pages5
JournalJournal of Power Sources
Volume186
Issue number1
DOIs
Publication statusPublished - 2009 Jan 1
Externally publishedYes

Keywords

  • Copper substrate
  • Copper-tin intermetallic compound
  • Intercalation
  • Lithium-ion battery
  • Phase control
  • Tin

ASJC Scopus subject areas

  • Renewable Energy, Sustainability and the Environment
  • Energy Engineering and Power Technology
  • Physical and Theoretical Chemistry
  • Electrical and Electronic Engineering

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