Effects of post etch treatments on contaminated silicon surface due to CHF₃/C₂F₆ reactive ion etching

H. H. Park, K. H. Kwon, S. H. Lee, S. Nahm, J. W. Lee, B. H. Koak, K. S. Suh, O. J. Kwon, J. L. Lee, G. Y. Yeom

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution