Abstract
Characteristics of Cu/C:H films on the PET substrate prepared by ECR-MOCVD coupled with a DC bias under Cu(hfac)2-Ar-H2 was investigated with special attention to process parameters. Our results showed that the Cu/C:H film has strongly adhere with the polymer substrate by chemical bonding and exhibited wide range of electrical conductivity that could be controlled by process parameters. The increase in H2/Ar ratio, microwave power and negative DC bias voltage brought on the higher pulling strength between Cu/C:H films and PET substrate. The effects of surface pretreatments of polymer substrate on pulling strength were insignificant in the range of our experimental range.
Original language | English |
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Pages (from-to) | 105-110 |
Number of pages | 6 |
Journal | Materials Research Society Symposium - Proceedings |
Volume | 795 |
DOIs | |
Publication status | Published - 2003 |
Event | Thin Films - Stresses and Mechanical Properties X - Boston, MA., United States Duration: 2003 Dec 1 → 2003 Dec 5 |
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering