Effects of processing temperatures of nickel plating on capacitance density of alumina film capacitor

Myung Sun Jeong, Byeong Kwon Ju, Jeon Kook Lee

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)


We observed the effects of nickel plating temperatures for controlling the surface morphologies of the deposited nickel layers on the alumina nano-pores. The alumina nano-channels were filled with nickel at various processing temperatures of 60∼90 °C. The electrical properties of the alumina film capacitors were changed with processing temperatures. The electroless nickel plating (ENP) at 60 °C improved the nickel penetration into the alumina nano-channels due to the reduced reaction rate. Nickel layers are uniformly formed on the high aspect ratio alumina pores. Due to the uniform nickel electrode, the capacitance density of the alumina film capacitors is improved by the low leakage current, dissipation factor and equivalent series resistance. Alumina film capacitors made by ENP at 60 °C had a high capacitance density of 160 nF/cm2.

Original languageEnglish
Pages (from-to)4530-4533
Number of pages4
JournalJournal of Nanoscience and Nanotechnology
Issue number6
Publication statusPublished - 2015 Jun 1

Bibliographical note

Publisher Copyright:
© 2015 American Scientific Publishers All rights reserved.


  • Alumina film capacitor
  • Alumina nano-channel
  • Electroless plating
  • Nickel electrode
  • Processing temperature

ASJC Scopus subject areas

  • Bioengineering
  • General Chemistry
  • Biomedical Engineering
  • General Materials Science
  • Condensed Matter Physics


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