Effects of solvents, activators, and additives on sintering properties of Cu paste for die attach

Junhyuk Son, Dong Yurl Yu, Yun Chan Kim, Shin Il Kim, Dongjin Byun, Jung Hwan Bang

Research output: Contribution to journalArticlepeer-review

Abstract

Cu sintering has attracted considerable attention because of its low electrical resistance, high thermal conductivity, low resistance to ion migration, and reasonable price. But, the unique oxidation tendency of Cu is the leading cause of hindering Cu sintering. Several methods have been proposed to solve this oxidation problem. In this study, Cu paste for die attachment was prepared by selecting appropriate solvents, activators, and additives. The sintering properties and bonding strength of Cu paste were governed by the molecular weight and the chain length of the solvent. Among various solvents, the highest shear strength was observed in the case of polyethylene glycol (PEG) solvent. The addition of dicarboxylic acid allowed for a faster reduction rate of copper oxide, which improved Cu sintering performance. A Cu binder with a stable reduction reaction and storage stability was developed by applying a phenol-based antioxidant.

Original languageEnglish
Article number1459
JournalJournal of Materials Science: Materials in Electronics
Volume34
Issue number19
DOIs
Publication statusPublished - 2023 Jul

Bibliographical note

Funding Information:
This work was supported by research funds from the Korea Institute of Industrial Technology (KITECH) (No. 20018145).

Publisher Copyright:
© 2023, The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature.

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

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