Electric field assembled anisotropic dielectric layer for metal core printed circuit boards

Myong Jae Yoo; Hyun Min Cho; Seong Hwan Kim; Ho Sun Lim; Seong Dae Park; Woo Sung Lee; Jin Seong Kim; Tae Geun Seong; Byoung Jik Jeong; Sahn Nahm

doi:10.1109/LED.2012.2212872

Electric field assembled anisotropic dielectric layer for metal core printed circuit boards

Myong Jae Yoo, Hyun Min Cho, Seong Hwan Kim, Ho Sun Lim, Seong Dae Park, Woo Sung Lee, Jin Seong Kim, Tae Geun Seong, Byoung Jik Jeong, Sahn Nahm

Department of Materials Science and Engineering

Research output: Contribution to journal › Article › peer-review

2 Citations (Scopus)

Abstract

Thermal dissipation properties of metal core printed circuit boards (MCPCBs) with a dielectric layer having an anisotropically assembled microstructure are presented for dissipating heat of high-power transistors. The proposed MCPCB with an anisotropic microstructure was fabricated by applying an electric field simultaneously during the hot-pressing process. The effect of the anisotropically assembled microstructure of the dielectric layer compared with the conventionally fabricated dielectric layer was an increase in thermal diffusivity by the enhanced connectivity of fillers. Thermal transient measurements of high-power transistors with the proposed MCPCB were compared with those of high-power transistors with a conventional MCPCB. The developed MCPCB showed better heat dissipation performance and lower thermal resistance.

Original language	English
Article number	6311422
Pages (from-to)	1607-1609
Number of pages	3
Journal	IEEE Electron Device Letters
Volume	33
Issue number	11
DOIs	https://doi.org/10.1109/LED.2012.2212872
Publication status	Published - 2012

Keywords

Anisotropic assemble
composite
heat dissipation
high-power device
metal core printed circuit board (MCPCB)
thermal resistance

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/LED.2012.2212872

Cite this

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title = "Electric field assembled anisotropic dielectric layer for metal core printed circuit boards",

abstract = "Thermal dissipation properties of metal core printed circuit boards (MCPCBs) with a dielectric layer having an anisotropically assembled microstructure are presented for dissipating heat of high-power transistors. The proposed MCPCB with an anisotropic microstructure was fabricated by applying an electric field simultaneously during the hot-pressing process. The effect of the anisotropically assembled microstructure of the dielectric layer compared with the conventionally fabricated dielectric layer was an increase in thermal diffusivity by the enhanced connectivity of fillers. Thermal transient measurements of high-power transistors with the proposed MCPCB were compared with those of high-power transistors with a conventional MCPCB. The developed MCPCB showed better heat dissipation performance and lower thermal resistance.",

keywords = "Anisotropic assemble, composite, heat dissipation, high-power device, metal core printed circuit board (MCPCB), thermal resistance",

author = "Yoo, {Myong Jae} and Cho, {Hyun Min} and Kim, {Seong Hwan} and Lim, {Ho Sun} and Park, {Seong Dae} and Lee, {Woo Sung} and Kim, {Jin Seong} and Seong, {Tae Geun} and Jeong, {Byoung Jik} and Sahn Nahm",

note = "Funding Information: Manuscript received July 27, 2012; revised August 4, 2012; accepted August 7, 2012. Date of publication September 24, 2012; date of current version October 19, 2012. This work was supported by the Ministry of Knowledge Economy of Korea under Grant 10038631 from the Fundamental R&D Program for Core Technology of Industry. The review of this letter was arranged by Editor S. List.",

year = "2012",

doi = "10.1109/LED.2012.2212872",

language = "English",

volume = "33",

pages = "1607--1609",

journal = "IEEE Electron Device Letters",

issn = "0741-3106",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "11",

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TY - JOUR

T1 - Electric field assembled anisotropic dielectric layer for metal core printed circuit boards

AU - Yoo, Myong Jae

AU - Cho, Hyun Min

AU - Kim, Seong Hwan

AU - Lim, Ho Sun

AU - Park, Seong Dae

AU - Lee, Woo Sung

AU - Kim, Jin Seong

AU - Seong, Tae Geun

AU - Jeong, Byoung Jik

AU - Nahm, Sahn

N1 - Funding Information: Manuscript received July 27, 2012; revised August 4, 2012; accepted August 7, 2012. Date of publication September 24, 2012; date of current version October 19, 2012. This work was supported by the Ministry of Knowledge Economy of Korea under Grant 10038631 from the Fundamental R&D Program for Core Technology of Industry. The review of this letter was arranged by Editor S. List.

PY - 2012

Y1 - 2012

N2 - Thermal dissipation properties of metal core printed circuit boards (MCPCBs) with a dielectric layer having an anisotropically assembled microstructure are presented for dissipating heat of high-power transistors. The proposed MCPCB with an anisotropic microstructure was fabricated by applying an electric field simultaneously during the hot-pressing process. The effect of the anisotropically assembled microstructure of the dielectric layer compared with the conventionally fabricated dielectric layer was an increase in thermal diffusivity by the enhanced connectivity of fillers. Thermal transient measurements of high-power transistors with the proposed MCPCB were compared with those of high-power transistors with a conventional MCPCB. The developed MCPCB showed better heat dissipation performance and lower thermal resistance.

AB - Thermal dissipation properties of metal core printed circuit boards (MCPCBs) with a dielectric layer having an anisotropically assembled microstructure are presented for dissipating heat of high-power transistors. The proposed MCPCB with an anisotropic microstructure was fabricated by applying an electric field simultaneously during the hot-pressing process. The effect of the anisotropically assembled microstructure of the dielectric layer compared with the conventionally fabricated dielectric layer was an increase in thermal diffusivity by the enhanced connectivity of fillers. Thermal transient measurements of high-power transistors with the proposed MCPCB were compared with those of high-power transistors with a conventional MCPCB. The developed MCPCB showed better heat dissipation performance and lower thermal resistance.

KW - Anisotropic assemble

KW - composite

KW - heat dissipation

KW - high-power device

KW - metal core printed circuit board (MCPCB)

KW - thermal resistance

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U2 - 10.1109/LED.2012.2212872

DO - 10.1109/LED.2012.2212872

M3 - Article

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SN - 0741-3106

VL - 33

SP - 1607

EP - 1609

JO - IEEE Electron Device Letters

JF - IEEE Electron Device Letters

IS - 11

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ER -

Electric field assembled anisotropic dielectric layer for metal core printed circuit boards

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Keywords

ASJC Scopus subject areas

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