Keyphrases
Anisotropic Dielectric
100%
Anisotropic Microstructure
16%
Dielectric Layer
100%
Dissipation Properties
16%
Electric Field (E-field)
100%
Heat Dissipation Performance
16%
High-power Transistors
50%
Hot-pressing Process
16%
Low Thermal Resistance
16%
Metal Core Printed Circuit Board
100%
Microstructure
33%
Thermal Diffusivity
16%
Thermal Dissipation
16%
Thermal Transient Measurement
16%
Engineering
Anisotropic
100%
Dielectric Layer
100%
Electric Field
100%
Heat Losses
16%
Heat Resistance
16%
Hot Pressing
16%
Pressing Process
16%
Printed Circuit Board
100%
Thermal Diffusivity
16%
Thermal Dissipation
16%
Transients
16%
Material Science
Dielectric Material
100%
Diffusivity
16%
Electronic Circuit
100%
Heat Resistance
16%
Hot Pressing
16%
Transistor
50%