Electrical Characteristics of Thermally Stable Ag-Pd-Cu Alloy Schottky Contacts on n-Al0.6Ga0.4N

Kee Baek Sim, Su Kyung Kim, Tae Yeon Seong, Hiroshi Amano

    Research output: Contribution to journalArticlepeer-review

    1 Citation (Scopus)

    Abstract

    We report the fabrication of high-barrier-height and thermally reliable Schottky contacts to n-Al0.6Ga0.4N by using an Ag-Pd-Cu (APC) alloy. The Schottky barrier heights (SBHs) and ideality factors computed using the current-voltage (I-V) model ranged from 0.82 to 0.97 eV and from 3.15 to 3.44, respectively. The barrier inhomogeneity model and capacitance-voltage (C-V) method yielded higher SBHs (1.62-2.19 eV) than those obtained using the I-V model. The 300 °C-annealed APC sample exhibited more uniform electrical characteristics than the 500 °C-annealed Ni/Au Schottky samples (each with the best Schottky behavior). Furthermore, the scanning electron microscopy (SEM) and scanning transmission electron microscopy (STEM) results indicated that the APC Schottky contacts were more thermally stable than the Ni/Au contacts. On the basis of the X-ray photoemission spectroscopy (XPS) results, the improved Schottky characteristics of the APC alloy contacts are described and discussed.

    Original languageEnglish
    Article number115007
    JournalECS Journal of Solid State Science and Technology
    Volume11
    Issue number11
    DOIs
    Publication statusPublished - 2022 Nov

    Bibliographical note

    Funding Information:
    This work was supported by the National Research Foundation (NRF) of Korea (NRF-2017K1A1A2013160 and NRF-2022R1A2C2006887).

    Publisher Copyright:
    © 2022 The Electrochemical Society (“ECS”). Published on behalf of ECS by IOP Publishing Limited.

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials

    Fingerprint

    Dive into the research topics of 'Electrical Characteristics of Thermally Stable Ag-Pd-Cu Alloy Schottky Contacts on n-Al0.6Ga0.4N'. Together they form a unique fingerprint.

    Cite this