Electrical characterization of ball grid array packages from S-parameter measurements below 500 MHz

J. Jeong, J. Jeong

    Research output: Contribution to conferencePaperpeer-review

    1 Citation (Scopus)

    Abstract

    We report electrical characterization of ball grid array (BGA) packages from only 1-port S-parameter measurements below 500 MHz. Capacitance, inductance and resistance of transmission lines in the packages are extracted. Extracted capacitances are compared with those from simulations and measurements at the low frequency.

    Original languageEnglish
    Pages61-64
    Number of pages4
    Publication statusPublished - 1998
    EventProceedings of the 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging - West Point, NY, USA
    Duration: 1998 Oct 261998 Oct 28

    Other

    OtherProceedings of the 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging
    CityWest Point, NY, USA
    Period98/10/2698/10/28

    ASJC Scopus subject areas

    • General Engineering

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