Abstract
We report electrical characterization of ball grid array (BGA) packages from only 1-port S-parameter measurements below 500 MHz. Capacitance, inductance and resistance of transmission lines in the packages are extracted. Extracted capacitances are compared with those from simulations and measurements at the low frequency.
| Original language | English |
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| Pages | 61-64 |
| Number of pages | 4 |
| Publication status | Published - 1998 |
| Event | Proceedings of the 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging - West Point, NY, USA Duration: 1998 Oct 26 → 1998 Oct 28 |
Other
| Other | Proceedings of the 1998 IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging |
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| City | West Point, NY, USA |
| Period | 98/10/26 → 98/10/28 |
ASJC Scopus subject areas
- Engineering(all)