Abstract
GaN metal oxide semiconductor diodes were demonstrated utilizing Sc2O3 as the gate oxide. Sc2O3 was grown at 100°C on MOCVD grown n-GaN layers in a molecular beam epitaxy system, using a scandium elemental source and an electron cyclotron resonance oxygen plasma. Ar/Cl2 based discharges were used to remove Sc2O3, to expose the underlying n-GaN for ohmic metal deposition in an inductively coupled plasma system. Electron beam deposited Ti/Al/Pt/Au and Pt/Au were utilized as ohmic and gate metallizations, respectively. An interface trap density of 5 × 1011 eV-1 cm-2 was obtained with the Terman method. Conductance-voltage measurements were also used to estimate the interface trap density and a slightly higher value was obtained as compared to the Terman method. Results of capacitance measurements at elevated temperature (up to 300°C) indicated the presence of deep states near the interface.
Original language | English |
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Pages (from-to) | G51-G53 |
Journal | Electrochemical and Solid-State Letters |
Volume | 5 |
Issue number | 7 |
DOIs | |
Publication status | Published - 2002 Jul |
Externally published | Yes |
ASJC Scopus subject areas
- General Chemical Engineering
- General Materials Science
- Physical and Theoretical Chemistry
- Electrochemistry
- Electrical and Electronic Engineering