Electrical properties of thermally stable Pt/Re/Au ohmic contacts to p-type GaN

Keyphrases

• Annealing 100%
• As-deposited 16%
• Au Layer 16%
• Auger Electron Spectroscopy 16%
• Cm(III) 16%
• Contact Resistivity 16%
• Electrical Properties 100%
• Glancing Angle X-ray Diffraction 16%
• I-V Characteristics 33%
• Interfacial Reaction 16%
• Metallization 16%
• Ohmic Behavior 16%
• Ohmic Contact 100%
• P-GaN 100%
• PtRe 100%
• Root-mean-square Roughness 16%
• Specific Contact Resistance 16%
• Surface Morphology 16%
• Thermally Stable 100%

Material Science

• Annealing 50%
• Contact Resistance 50%
• Current-Voltage Characteristic 100%
• Electrical Resistivity 50%
• Electron Microscopy 50%
• Surface Morphology 50%
• X-Ray Diffraction 50%

Physics

• Electrical Property 100%
• Electron Microscopy 100%
• Metallizing 100%
• X Ray Diffraction 100%