Electrochemical synthesis of Cu-doped ZnTe films as back contacts to CdTe solar cells

Yongseok Jun, Kang Jin Kim, Donghwan Kim

    Research output: Contribution to journalArticlepeer-review

    10 Citations (Scopus)

    Abstract

    Electrochemical deposition of Cu-doped ZnTe films was investigated as a back contact material for CdTe solar cells. The deposition system consisted of a potentiostat, a substrate (cathode), a Pt counter electrode, and an Ag/AgCl reference electrode. Experimental conditions were: pH=2.5∼4, deposition temperature=70 ∼80°C electrolyte concentration=0.02 M Zn2+, 10-4 M TeO2, and deposition potential (Va) = -0.85 ∼-1.0 V vs. Ag/AgCl. A cyclic voltammogram obtained from an ITO substrate showed a ZnTe reduction peak at Va = -0.7 ∼ -0.9 V. A film obtained at pH=2.5, Va=-0.975 V showed the strongest ZnTe X-ray diffraction peak, but its surface morphology was not as smooth as the films made under the condition of pH=3∼4, Va=-0.950V. Triethanolamine did not form a complex with Cu2+ in acidic solution as needed for uniform Cu-doping, but oxalate anion and 1,10-phenanthroline did at pH=2∼3. The efficiency of CdTe solar cells increased from 3.4% to 7.1% when Cu-doped ZnTe film was used as the back contact.

    Original languageEnglish
    Pages (from-to)279-285
    Number of pages7
    JournalMetals and Materials International
    Volume5
    Issue number3
    DOIs
    Publication statusPublished - 1999 Jun

    Bibliographical note

    Funding Information:
    The authors wish to acknowledge the financial support of the Korea Research Foundation made in the program year of 1997.

    Keywords

    • Back contacts
    • CdTe
    • Electro deposition
    • Solar cells
    • ZnTe

    ASJC Scopus subject areas

    • Condensed Matter Physics
    • Mechanics of Materials
    • Metals and Alloys
    • Materials Chemistry

    Fingerprint

    Dive into the research topics of 'Electrochemical synthesis of Cu-doped ZnTe films as back contacts to CdTe solar cells'. Together they form a unique fingerprint.

    Cite this