Encapsulated flexible organic light-emitting diodes: Progress toward a simple and cost effective contact printing technique

Hakkoo Kim; Eun Ho Song; Kyung Bok Choi; Ju Hyun Hwang; Young Wook Park; Byeong Kwon Ju

doi:10.1002/j.2168-0159.2013.tb06427.x

Encapsulated flexible organic light-emitting diodes: Progress toward a simple and cost effective contact printing technique

Hakkoo Kim, Eun Ho Song, Kyung Bok Choi, Ju Hyun Hwang, Young Wook Park, Byeong Kwon Ju

Research output: Contribution to journal › Article › peer-review

Abstract

We present a new methodology for encapsulation of flexible organic electronics that involves no electrochemical reactions. In this study, the encapsulation is formed using a simple, vacuum damage-free and rapid process utilizing a UV-curable resin. The fabricated device has superior reproducibility and uniformity, which makes it suitable for industrial mass production.

Original language	English
Pages (from-to)	1137-1139
Number of pages	3
Journal	Digest of Technical Papers - SID International Symposium
Volume	44
Issue number	1
DOIs	https://doi.org/10.1002/j.2168-0159.2013.tb06427.x
Publication status	Published - 2013 Jun

Keywords

Contact printing
Encapsulation
Flexible organic light-emitting diodes (FOLED)
Solvent damage-free

ASJC Scopus subject areas

General Engineering

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10.1002/j.2168-0159.2013.tb06427.x

Cite this

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abstract = "We present a new methodology for encapsulation of flexible organic electronics that involves no electrochemical reactions. In this study, the encapsulation is formed using a simple, vacuum damage-free and rapid process utilizing a UV-curable resin. The fabricated device has superior reproducibility and uniformity, which makes it suitable for industrial mass production.",

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author = "Hakkoo Kim and Song, {Eun Ho} and Choi, {Kyung Bok} and Hwang, {Ju Hyun} and Park, {Young Wook} and Ju, {Byeong Kwon}",

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AU - Park, Young Wook

AU - Ju, Byeong Kwon

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KW - Solvent damage-free

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Encapsulated flexible organic light-emitting diodes: Progress toward a simple and cost effective contact printing technique

Abstract

Keywords

ASJC Scopus subject areas

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