Abstract
We present a new methodology for encapsulation of flexible organic electronics that involves no electrochemical reactions. In this study, the encapsulation is formed using a simple, vacuum damage-free and rapid process utilizing a UV-curable resin. The fabricated device has superior reproducibility and uniformity, which makes it suitable for industrial mass production.
Original language | English |
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Pages (from-to) | 1137-1139 |
Number of pages | 3 |
Journal | Digest of Technical Papers - SID International Symposium |
Volume | 44 |
Issue number | 1 |
DOIs | |
Publication status | Published - 2013 Jun |
Keywords
- Contact printing
- Encapsulation
- Flexible organic light-emitting diodes (FOLED)
- Solvent damage-free
ASJC Scopus subject areas
- General Engineering