Encapsulated flexible organic light-emitting diodes: Progress toward a simple and cost effective contact printing technique

Hakkoo Kim, Eun Ho Song, Kyung Bok Choi, Ju Hyun Hwang, Young Wook Park, Byeong Kwon Ju

    Research output: Contribution to journalArticlepeer-review

    Abstract

    We present a new methodology for encapsulation of flexible organic electronics that involves no electrochemical reactions. In this study, the encapsulation is formed using a simple, vacuum damage-free and rapid process utilizing a UV-curable resin. The fabricated device has superior reproducibility and uniformity, which makes it suitable for industrial mass production.

    Original languageEnglish
    Pages (from-to)1137-1139
    Number of pages3
    JournalDigest of Technical Papers - SID International Symposium
    Volume44
    Issue number1
    DOIs
    Publication statusPublished - 2013 Jun

    Keywords

    • Contact printing
    • Encapsulation
    • Flexible organic light-emitting diodes (FOLED)
    • Solvent damage-free

    ASJC Scopus subject areas

    • General Engineering

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