Encapsulated flexible organic light-emitting diodes: Progress toward a simple and cost effective contact printing technique

Hakkoo Kim; Eun Ho Song; Kyung Bok Choi; Ju Hyun Hwang; Young Wook Park; Byeong Kwon Ju

doi:10.1002/j.2168-0159.2013.tb06427.x

Encapsulated flexible organic light-emitting diodes: Progress toward a simple and cost effective contact printing technique

Hakkoo Kim
, Eun Ho Song
, Kyung Bok Choi
, Ju Hyun Hwang
, Young Wook Park
, Byeong Kwon Ju

Research output: Contribution to journal › Article › peer-review

Abstract

We present a new methodology for encapsulation of flexible organic electronics that involves no electrochemical reactions. In this study, the encapsulation is formed using a simple, vacuum damage-free and rapid process utilizing a UV-curable resin. The fabricated device has superior reproducibility and uniformity, which makes it suitable for industrial mass production.

Original language	English
Pages (from-to)	1137-1139
Number of pages	3
Journal	Digest of Technical Papers - SID International Symposium
Volume	44
Issue number	1
DOIs	https://doi.org/10.1002/j.2168-0159.2013.tb06427.x
Publication status	Published - 2013 Jun

Keywords

Contact printing
Encapsulation
Flexible organic light-emitting diodes (FOLED)
Solvent damage-free

ASJC Scopus subject areas

General Engineering

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10.1002/j.2168-0159.2013.tb06427.x

Cite this

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title = "Encapsulated flexible organic light-emitting diodes: Progress toward a simple and cost effective contact printing technique",

abstract = "We present a new methodology for encapsulation of flexible organic electronics that involves no electrochemical reactions. In this study, the encapsulation is formed using a simple, vacuum damage-free and rapid process utilizing a UV-curable resin. The fabricated device has superior reproducibility and uniformity, which makes it suitable for industrial mass production.",

keywords = "Contact printing, Encapsulation, Flexible organic light-emitting diodes (FOLED), Solvent damage-free",

author = "Hakkoo Kim and Song, \{Eun Ho\} and Choi, \{Kyung Bok\} and Hwang, \{Ju Hyun\} and Park, \{Young Wook\} and Ju, \{Byeong Kwon\}",

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AU - Kim, Hakkoo

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AU - Choi, Kyung Bok

AU - Hwang, Ju Hyun

AU - Park, Young Wook

AU - Ju, Byeong Kwon

PY - 2013/6

Y1 - 2013/6

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AB - We present a new methodology for encapsulation of flexible organic electronics that involves no electrochemical reactions. In this study, the encapsulation is formed using a simple, vacuum damage-free and rapid process utilizing a UV-curable resin. The fabricated device has superior reproducibility and uniformity, which makes it suitable for industrial mass production.

KW - Contact printing

KW - Encapsulation

KW - Flexible organic light-emitting diodes (FOLED)

KW - Solvent damage-free

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M3 - Article

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Encapsulated flexible organic light-emitting diodes: Progress toward a simple and cost effective contact printing technique

Abstract

Keywords

ASJC Scopus subject areas

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