Enhanced adhesion with pedestal-shaped elastomeric stamps for transfer printing

Seok Kim; Andrew Carlson; Huanyu Cheng; Seungwoo Lee; Jung Ki Park; Yonggang Huang; John A. Rogers

doi:10.1063/1.4706257

Enhanced adhesion with pedestal-shaped elastomeric stamps for transfer printing

Seok Kim, Andrew Carlson, Huanyu Cheng, Seungwoo Lee, Jung Ki Park, Yonggang Huang, John A. Rogers

KU-KIST Graduate School of Converging Science and Technology

Research output: Contribution to journal › Article › peer-review

60 Citations (Scopus)

Abstract

Microscale elastomeric relief structures with "pedestal" shapes provide enhanced operation in stamps designed for deterministic materials assembly via transfer printing. Experimental measurements of adhesion and finite element analysis both show that for certain geometries, exceptionally large enhancements in adhesion strength (over 15×) can be achieved. Transfer printing of microscale platelets of silicon and ultrathin gallium nitride light emitting diodes onto a silicon substrate without adhesive coatings demonstrates some capabilities in assembly that result from this type of stamp, of interest in diverse applications, including those that involve heterogeneous materials integration.

Original language	English
Article number	171909
Journal	Applied Physics Letters
Volume	100
Issue number	17
DOIs	https://doi.org/10.1063/1.4706257
Publication status	Published - 2012 Apr 23

ASJC Scopus subject areas

Physics and Astronomy (miscellaneous)

Access to Document

10.1063/1.4706257

Cite this

@article{ff7a7790c23345728d7e4ac963e7e20f,

title = "Enhanced adhesion with pedestal-shaped elastomeric stamps for transfer printing",

abstract = "Microscale elastomeric relief structures with {"}pedestal{"} shapes provide enhanced operation in stamps designed for deterministic materials assembly via transfer printing. Experimental measurements of adhesion and finite element analysis both show that for certain geometries, exceptionally large enhancements in adhesion strength (over 15×) can be achieved. Transfer printing of microscale platelets of silicon and ultrathin gallium nitride light emitting diodes onto a silicon substrate without adhesive coatings demonstrates some capabilities in assembly that result from this type of stamp, of interest in diverse applications, including those that involve heterogeneous materials integration.",

author = "Seok Kim and Andrew Carlson and Huanyu Cheng and Seungwoo Lee and Park, {Jung Ki} and Yonggang Huang and Rogers, {John A.}",

year = "2012",

month = apr,

day = "23",

doi = "10.1063/1.4706257",

language = "English",

volume = "100",

journal = "Applied Physics Letters",

issn = "0003-6951",

publisher = "American Institute of Physics",

number = "17",

}

TY - JOUR

T1 - Enhanced adhesion with pedestal-shaped elastomeric stamps for transfer printing

AU - Kim, Seok

AU - Carlson, Andrew

AU - Cheng, Huanyu

AU - Lee, Seungwoo

AU - Park, Jung Ki

AU - Huang, Yonggang

AU - Rogers, John A.

PY - 2012/4/23

Y1 - 2012/4/23

N2 - Microscale elastomeric relief structures with "pedestal" shapes provide enhanced operation in stamps designed for deterministic materials assembly via transfer printing. Experimental measurements of adhesion and finite element analysis both show that for certain geometries, exceptionally large enhancements in adhesion strength (over 15×) can be achieved. Transfer printing of microscale platelets of silicon and ultrathin gallium nitride light emitting diodes onto a silicon substrate without adhesive coatings demonstrates some capabilities in assembly that result from this type of stamp, of interest in diverse applications, including those that involve heterogeneous materials integration.

AB - Microscale elastomeric relief structures with "pedestal" shapes provide enhanced operation in stamps designed for deterministic materials assembly via transfer printing. Experimental measurements of adhesion and finite element analysis both show that for certain geometries, exceptionally large enhancements in adhesion strength (over 15×) can be achieved. Transfer printing of microscale platelets of silicon and ultrathin gallium nitride light emitting diodes onto a silicon substrate without adhesive coatings demonstrates some capabilities in assembly that result from this type of stamp, of interest in diverse applications, including those that involve heterogeneous materials integration.

UR - http://www.scopus.com/inward/record.url?scp=84860343253&partnerID=8YFLogxK

U2 - 10.1063/1.4706257

DO - 10.1063/1.4706257

M3 - Article

AN - SCOPUS:84860343253

SN - 0003-6951

VL - 100

JO - Applied Physics Letters

JF - Applied Physics Letters

IS - 17

M1 - 171909

ER -

Enhanced adhesion with pedestal-shaped elastomeric stamps for transfer printing

Abstract

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this