Enhanced growth kinetics of intermetallic compounds between bicontaining Sn-3.5Ag solders and Cu substrate during aging

Soon Tae Kim; Joo Youl Huh

doi:10.4028/0-87849-960-1.2627

Enhanced growth kinetics of intermetallic compounds between bicontaining Sn-3.5Ag solders and Cu substrate during aging

Soon Tae Kim, Joo Youl Huh

Department of Materials Science and Engineering

Research output: Contribution to journal › Conference article › peer-review

Abstract

The effect of adding Bi to a eutectic Sn-3.5Ag solder alloy on the growth kinetics of the intermetallic compounds (IMCs) in solder/Cu joints was examined at the aging temperatures of 130°C, 150°C and 180°C. At 150°C and 180°C, the growth rate of the Cu₆Sn₅ layer was significantly enhanced, but that of the Cu₃Sn layer was rather reduced with increasing Bi content up to 12 wt.%. At 130°C, however, both the η and ε layers appeared to grow faster as the Bi content in the solder was increased to 12 wt.%. These results suggest that the accumulation of Bi ahead of the Cu₆Sn₅ layers can affect not only the interfacial reaction barrier but also the local thermodynamics at the interface between the Cu₆Sn₅ layer and the solder.

Original language	English
Pages (from-to)	2627-2630
Number of pages	4
Journal	Materials Science Forum
Volume	475-479
Issue number	IV
DOIs	https://doi.org/10.4028/0-87849-960-1.2627
Publication status	Published - 2005
Event	PRICM 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing - Beijing, China Duration: 2004 Nov 2 → 2004 Nov 5

Keywords

Growth kinetics
Intermetallic compounds
Sn-Ag-Bi solder

ASJC Scopus subject areas

Materials Science(all)
Condensed Matter Physics
Mechanics of Materials
Mechanical Engineering

Access to Document

10.4028/0-87849-960-1.2627

Cite this

@article{5630c242e489427aaef7d5422ff56646,

title = "Enhanced growth kinetics of intermetallic compounds between bicontaining Sn-3.5Ag solders and Cu substrate during aging",

abstract = "The effect of adding Bi to a eutectic Sn-3.5Ag solder alloy on the growth kinetics of the intermetallic compounds (IMCs) in solder/Cu joints was examined at the aging temperatures of 130°C, 150°C and 180°C. At 150°C and 180°C, the growth rate of the Cu6Sn5 layer was significantly enhanced, but that of the Cu3Sn layer was rather reduced with increasing Bi content up to 12 wt.%. At 130°C, however, both the η and ε layers appeared to grow faster as the Bi content in the solder was increased to 12 wt.%. These results suggest that the accumulation of Bi ahead of the Cu6Sn5 layers can affect not only the interfacial reaction barrier but also the local thermodynamics at the interface between the Cu6Sn5 layer and the solder.",

keywords = "Growth kinetics, Intermetallic compounds, Sn-Ag-Bi solder",

author = "Kim, {Soon Tae} and Huh, {Joo Youl}",

year = "2005",

doi = "10.4028/0-87849-960-1.2627",

language = "English",

volume = "475-479",

pages = "2627--2630",

journal = "Materials Science Forum",

issn = "0255-5476",

publisher = "Trans Tech Publications",

number = "IV",

note = "PRICM 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing ; Conference date: 02-11-2004 Through 05-11-2004",

}

TY - JOUR

T1 - Enhanced growth kinetics of intermetallic compounds between bicontaining Sn-3.5Ag solders and Cu substrate during aging

AU - Kim, Soon Tae

AU - Huh, Joo Youl

PY - 2005

Y1 - 2005

N2 - The effect of adding Bi to a eutectic Sn-3.5Ag solder alloy on the growth kinetics of the intermetallic compounds (IMCs) in solder/Cu joints was examined at the aging temperatures of 130°C, 150°C and 180°C. At 150°C and 180°C, the growth rate of the Cu6Sn5 layer was significantly enhanced, but that of the Cu3Sn layer was rather reduced with increasing Bi content up to 12 wt.%. At 130°C, however, both the η and ε layers appeared to grow faster as the Bi content in the solder was increased to 12 wt.%. These results suggest that the accumulation of Bi ahead of the Cu6Sn5 layers can affect not only the interfacial reaction barrier but also the local thermodynamics at the interface between the Cu6Sn5 layer and the solder.

AB - The effect of adding Bi to a eutectic Sn-3.5Ag solder alloy on the growth kinetics of the intermetallic compounds (IMCs) in solder/Cu joints was examined at the aging temperatures of 130°C, 150°C and 180°C. At 150°C and 180°C, the growth rate of the Cu6Sn5 layer was significantly enhanced, but that of the Cu3Sn layer was rather reduced with increasing Bi content up to 12 wt.%. At 130°C, however, both the η and ε layers appeared to grow faster as the Bi content in the solder was increased to 12 wt.%. These results suggest that the accumulation of Bi ahead of the Cu6Sn5 layers can affect not only the interfacial reaction barrier but also the local thermodynamics at the interface between the Cu6Sn5 layer and the solder.

KW - Growth kinetics

KW - Intermetallic compounds

KW - Sn-Ag-Bi solder

UR - http://www.scopus.com/inward/record.url?scp=17044436664&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=17044436664&partnerID=8YFLogxK

U2 - 10.4028/0-87849-960-1.2627

DO - 10.4028/0-87849-960-1.2627

M3 - Conference article

AN - SCOPUS:17044436664

SN - 0255-5476

VL - 475-479

SP - 2627

EP - 2630

JO - Materials Science Forum

JF - Materials Science Forum

IS - IV

T2 - PRICM 5: The Fifth Pacific Rim International Conference on Advanced Materials and Processing

Y2 - 2 November 2004 through 5 November 2004

ER -

Enhanced growth kinetics of intermetallic compounds between bicontaining Sn-3.5Ag solders and Cu substrate during aging

Abstract

Keywords

ASJC Scopus subject areas

Access to Document

Other files and links

Fingerprint

Cite this