Heat transfer is crucial to the fabrication of high efficiency light emitting diode (LED) packages. The effectiveness of the heat transfer depends on the package materials and design. This paper presents an application of high thermal conductivity aluminum nitride (AlN) films to replace low thermal conductivity epoxy resin or alumina substrates. The AlN film was directly deposited on an aluminum plate which enabled the removal of thermal interface materials (TIM) such as the adhesive thermal bonding sheets that are used in conventional metal printed circuit board (PCB)-based LED packaging process. A fully dense AlN ceramic film was successfully deposited at room temperature using the aerosol deposition method. The thermal resistance, a parameter of the heat transfer characteristic of an LED package, was measured using a thermal transient tester. The results showed that the thermal resistance of the LED package mounted on the AlN thick film was 28.5 K/W, while an LED package mounted on a conventional epoxy-based metal PCB and a PCB with thermal vias were 47.2 K/W and 36.5 K/W, respectively. This indicates that an aerosol-deposited AlN-based LED package exhibits greatly enhanced heat transfer compared to the conventional metal PCB.
|Number of pages
|Applied Thermal Engineering
|Published - 2013
Bibliographical noteFunding Information:
This work was supported by the R&D support program of the Small & Medium Business Administration (SMBA), Korea (Grant No. S1071285 ; 2010–2012).
- Aerosol deposition
- Aluminum nitride film
- Heat transfer
- Light emitting diode
ASJC Scopus subject areas
- Energy Engineering and Power Technology
- Industrial and Manufacturing Engineering