Enhanced thermal conductivity of epoxy/Cu-plated carbon fiber fabric composites

Seunggun Yu; Kyusup Park; Jang Woo Lee; Soon Man Hong; Cheolmin Park; Tae Hee Han; Chong Min Koo

doi:10.1007/s13233-017-5114-9

Enhanced thermal conductivity of epoxy/Cu-plated carbon fiber fabric composites

Seunggun Yu, Kyusup Park, Jang Woo Lee, Soon Man Hong, Cheolmin Park, Tae Hee Han, Chong Min Koo

Research output: Contribution to journal › Article › peer-review

21 Citations (Scopus)

Abstract

Enhanced heat conduction behavior of epoxy/polyacrylonitrile-based carbon fiber fabric composites was developed through Cu electroplating on carbon fiber fabrics. The polyacrylonitrile-based carbon fiber fabric with low thermal conductivity was employed as a template to form continuous Cu thermal conduction pathway. The epoxy composites with the continuous heat conduction pathway exhibited high thermal conductivities of 7.70 W/mK in the parallel direction, and 0.96 W/mK in the perpendicular direction, even with a lower Cu content of 3.5 vol%, which is a 220% and 70% increase over those of the epoxy/carbon fiber composites with isolated Cu beads, respectively. The experimental thermal conductivities of the composites were compared to the theoretically calculated values based on the Hatta and Taya models. Our simple approach offers a straightforward strategy to enhance thermal conductivity of polymer composites through incorporating the continuous Cu thin layers as an efficient thermal conduction pathway. [Figure not available: see fulltext.]

Original language	English
Pages (from-to)	559-564
Number of pages	6
Journal	Macromolecular Research
Volume	25
Issue number	6
DOIs	https://doi.org/10.1007/s13233-017-5114-9
Publication status	Published - 2017 Jun 1

Bibliographical note

Funding Information:
Acknowledgments: This work was supported by a grant from Fundamental R&D Program for Core Technology of Materials and Industrial Strategic Technology Development Program funded by the Ministry of Trade, Industry and Energy, Republic of Korea and was partially supported by the Korea Institute of Science and Technology (KIST) and the researchfundofHanyangUniversity (HY-球爃猃?).This researcsh a wlsaosup-portedbyBasicScienceResearchProgramthroughtheNationalResearch Foundation of Korea (NRF) funded by the Ministry of Science, ICT & Future Planning.

Publisher Copyright:
© 2017, The Polymer Society of Korea and Springer Science+Business Media B.V.

Keywords

Cu
carbon fiber
composite materials
electroplating
low percolation
thermal conductivity

ASJC Scopus subject areas

General Chemical Engineering
Organic Chemistry
Polymers and Plastics
Materials Chemistry

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10.1007/s13233-017-5114-9

Cite this

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title = "Enhanced thermal conductivity of epoxy/Cu-plated carbon fiber fabric composites",

abstract = "Enhanced heat conduction behavior of epoxy/polyacrylonitrile-based carbon fiber fabric composites was developed through Cu electroplating on carbon fiber fabrics. The polyacrylonitrile-based carbon fiber fabric with low thermal conductivity was employed as a template to form continuous Cu thermal conduction pathway. The epoxy composites with the continuous heat conduction pathway exhibited high thermal conductivities of 7.70 W/mK in the parallel direction, and 0.96 W/mK in the perpendicular direction, even with a lower Cu content of 3.5 vol%, which is a 220% and 70% increase over those of the epoxy/carbon fiber composites with isolated Cu beads, respectively. The experimental thermal conductivities of the composites were compared to the theoretically calculated values based on the Hatta and Taya models. Our simple approach offers a straightforward strategy to enhance thermal conductivity of polymer composites through incorporating the continuous Cu thin layers as an efficient thermal conduction pathway. [Figure not available: see fulltext.]",

keywords = "Cu, carbon fiber, composite materials, electroplating, low percolation, thermal conductivity",

author = "Seunggun Yu and Kyusup Park and Lee, {Jang Woo} and Hong, {Soon Man} and Cheolmin Park and Han, {Tae Hee} and Koo, {Chong Min}",

note = "Funding Information: Acknowledgments: This work was supported by a grant from Fundamental R&D Program for Core Technology of Materials and Industrial Strategic Technology Development Program funded by the Ministry of Trade, Industry and Energy, Republic of Korea and was partially supported by the Korea Institute of Science and Technology (KIST) and the researchfundofHanyangUniversity (HY-球爃猃?).This researcsh a wlsaosup-portedbyBasicScienceResearchProgramthroughtheNationalResearch Foundation of Korea (NRF) funded by the Ministry of Science, ICT & Future Planning. Publisher Copyright: {\textcopyright} 2017, The Polymer Society of Korea and Springer Science+Business Media B.V.",

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AU - Yu, Seunggun

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AU - Lee, Jang Woo

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AU - Park, Cheolmin

AU - Han, Tae Hee

AU - Koo, Chong Min

N1 - Funding Information: Acknowledgments: This work was supported by a grant from Fundamental R&D Program for Core Technology of Materials and Industrial Strategic Technology Development Program funded by the Ministry of Trade, Industry and Energy, Republic of Korea and was partially supported by the Korea Institute of Science and Technology (KIST) and the researchfundofHanyangUniversity (HY-球爃猃?).This researcsh a wlsaosup-portedbyBasicScienceResearchProgramthroughtheNationalResearch Foundation of Korea (NRF) funded by the Ministry of Science, ICT & Future Planning. Publisher Copyright: © 2017, The Polymer Society of Korea and Springer Science+Business Media B.V.

PY - 2017/6/1

Y1 - 2017/6/1

N2 - Enhanced heat conduction behavior of epoxy/polyacrylonitrile-based carbon fiber fabric composites was developed through Cu electroplating on carbon fiber fabrics. The polyacrylonitrile-based carbon fiber fabric with low thermal conductivity was employed as a template to form continuous Cu thermal conduction pathway. The epoxy composites with the continuous heat conduction pathway exhibited high thermal conductivities of 7.70 W/mK in the parallel direction, and 0.96 W/mK in the perpendicular direction, even with a lower Cu content of 3.5 vol%, which is a 220% and 70% increase over those of the epoxy/carbon fiber composites with isolated Cu beads, respectively. The experimental thermal conductivities of the composites were compared to the theoretically calculated values based on the Hatta and Taya models. Our simple approach offers a straightforward strategy to enhance thermal conductivity of polymer composites through incorporating the continuous Cu thin layers as an efficient thermal conduction pathway. [Figure not available: see fulltext.]

AB - Enhanced heat conduction behavior of epoxy/polyacrylonitrile-based carbon fiber fabric composites was developed through Cu electroplating on carbon fiber fabrics. The polyacrylonitrile-based carbon fiber fabric with low thermal conductivity was employed as a template to form continuous Cu thermal conduction pathway. The epoxy composites with the continuous heat conduction pathway exhibited high thermal conductivities of 7.70 W/mK in the parallel direction, and 0.96 W/mK in the perpendicular direction, even with a lower Cu content of 3.5 vol%, which is a 220% and 70% increase over those of the epoxy/carbon fiber composites with isolated Cu beads, respectively. The experimental thermal conductivities of the composites were compared to the theoretically calculated values based on the Hatta and Taya models. Our simple approach offers a straightforward strategy to enhance thermal conductivity of polymer composites through incorporating the continuous Cu thin layers as an efficient thermal conduction pathway. [Figure not available: see fulltext.]

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Enhanced thermal conductivity of epoxy/Cu-plated carbon fiber fabric composites

Abstract

Bibliographical note

Keywords

ASJC Scopus subject areas

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