Enhanced thermal conductivity of polymer composites filled with hybrid filler

Geon Woong Lee, Min Park, Junkyung Kim, Jae Ik Lee, Ho Gyu Yoon

Research output: Contribution to journalArticlepeer-review

726 Citations (Scopus)


This study aims at investigating package materials based on polymer matrix for microelectronics. The next generation package materials are expected to possess high heat dissipation capability in addition to low coefficient of thermal expansion (CTE) as the accumulated heat from high performance electronic devices should be removed for proper operation. In this study, various inorganic fillers including aluminum nitride (AlN), wollastonite, silicon carbide whisker (SiC) and boron nitride (BN) with different shape and size were used alone or in combination to prepare thermally conductive polymer composites. In case of AlN, titanate coupling agent was used for the surface treatment of fillers. The use of hybrid filler was found to be effective in increasing thermal conductivity of the composite probably due to the enhanced connectivity offered by structuring filler with high aspect ratio in hybrid filler. For given filler loading, the use of larger particle and surface treated filler resulted in composite materials with enhanced thermal conductivity. The surface treatment of filler also allowed producing the composites with lower CTE.

Original languageEnglish
Pages (from-to)727-734
Number of pages8
JournalComposites Part A: Applied Science and Manufacturing
Issue number5
Publication statusPublished - 2006 May


  • A. Hybrid
  • B. Thermal properties
  • D. Thermal analysis
  • E.
  • Powder processing

ASJC Scopus subject areas

  • Ceramics and Composites
  • Mechanics of Materials


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