Abstract
A Ru capping layer is employed to improve the thermal stability of Ag ohmic reflectors for high-power GaN-based light-emitting diodes (LEDs). The 20-nm-thick Ru capping layer is shown to be fairly effective in suppressing agglomeration by forming RuO 2. The Ag/Ru contacts exhibit specific contact resistance of 8.1 × 10 -5 Ω cm 2 and reflectance of ∼89% at a wavelength of 450 nm when annealed at 500°C for 1 min, which are much better than that of Ag only contacts. Blue LEDs fabricated with the 500°C-annealed Ag/Ru contacts give a forward voltage of 2.98 V at an injection current of 20 mA, which is lower than that (3.02 V) of LEDs with the 500°C-annealed Ag only contacts. LEDs with the 500°C-annealed Ag/Ru contacts show 25% higher output power (at 20 mA) than LEDs with the 500°C-annealed Ag only contacts. X-ray photoemission spectroscopy examinations are performed to describe the improved electrical performance of the Ag/Ru contacts.
Original language | English |
---|---|
Pages (from-to) | 357-363 |
Number of pages | 7 |
Journal | Superlattices and Microstructures |
Volume | 52 |
Issue number | 3 |
DOIs | |
Publication status | Published - 2012 Sept |
Keywords
- A Ru capping layer
- Ag ohmic reflector
- GaN
- Light-emitting diode
ASJC Scopus subject areas
- Materials Science(all)
- Condensed Matter Physics
- Electrical and Electronic Engineering