Enhancing the reliability of InP-based QD color conversion layer through a uniform organic encapsulation layer via inkjet printing

  • Sang Youn Lee
  • , Chun Sakong*
  • , Byeong Kwon Ju*
  • , Kwan Hyun Cho*
  • *Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

Abstract

Quantum dot (QD) as a color conversion layer (CCL) is gaining increasing attention for use in next generation displays. However, QD CCL, especially those based on indium phosphide (InP) materials, are vulnerable to oxygen and moisture. Accordingly, even in CCL technology, encapsulation is essential to mitigate performance reduction due to the degradation of color conversion efficiency (CCE). Herein, we employed only acrylic-based resin to produce a uniform encapsulation layer on a CCL, enhancing the CCE reliability of the QD CCL under ambient conditions. To print a uniform encapsulation layer, we confirmed the significance of the minimized surface energy differences on glass, bank, and QD film through O2 plasma treatment. We also investigated coating characteristics through adjustment of the drop spacing to analyze the reliability of the CCL. Compared to the CCL without an encapsulation layer, the CCE only showed a decrease of 1.96 % at green and 3.6 % at red light, after 168 h. The T95 (time to 95 % of the initial luminance) was improved from 5.25 h to 75.02 h by applying the encapsulation layer. As a result, we enhanced the stability of the InP-based QD CCL by printing only an organic encapsulation layer using the inkjet printing process.

Original languageEnglish
Article number107136
JournalOrganic Electronics
Volume135
DOIs
Publication statusPublished - 2024 Dec

Bibliographical note

Publisher Copyright:
© 2024

Keywords

  • Color conversion
  • Encapsulation
  • Inkjet printing
  • Quantum dots
  • Surface energy

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Biomaterials
  • General Chemistry
  • Condensed Matter Physics
  • Materials Chemistry
  • Electrical and Electronic Engineering

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