Abstract
Two kinds of polished and unpolished free-standing films prepared by the d.c. plasma CVD method were impacted by SiC particles to understand erosion mechanism. Erosion damage caused by solid impact was characterized using a surface profilometer, scanning electron microscopy and Raman spectroscopy. A gradual decrease of surface roughness and a sharp reduction of crystallinity were observed for unpolished CVD films with increasing erosion time. It was found that smaller grains of diamond were removed in the early stage of erosion process, and larger grains were eroded with further impingement. By introduction of the regrowth method on polished diamond, a further understanding of erosion mechanism was achieved. Most of the surface fractures were initiated at the grain boundary.
| Original language | English |
|---|---|
| Pages (from-to) | 865-870 |
| Number of pages | 6 |
| Journal | Diamond and Related Materials |
| Volume | 8 |
| Issue number | 2-5 |
| DOIs | |
| Publication status | Published - 1999 Mar |
Bibliographical note
Funding Information:Part of this work was supported by the Ceramic Processing Research Center. Special thanks are extended to Dr Y.J. Baik and Mr J.K. Lee at the Korea Institute of Science and Technology for discussions and help in diamond depositions.
Keywords
- CVD
- Free-standing
- Infra-red
- Mechanical properties
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- General Chemistry
- Mechanical Engineering
- General Physics and Astronomy
- Materials Chemistry
- Electrical and Electronic Engineering