Error resilient 3-D mesh compression

Sung Bum Park, Chang-Su Kim, Sang Uk Lee

    Research output: Contribution to journalArticlepeer-review

    24 Citations (Scopus)

    Abstract

    An error resilient three-dimensional (3-D) mesh coding system is proposed in this paper. The encoder uses a shape adaptive data partitioning scheme to alleviate the effect of error propagation. An input mesh surface is coarsely divided into smooth and detailed regions, and each region is further divided into partitions of similar sizes. Then, those partitions are progressively compressed and their joint boundaries are compressed using the boundary edge collapse rule. At the decoder, the boundary edge collapse rule facilitates the seamless assembly of the partitions. When no data is available for a partition due to transmission errors, we employ a concealment scheme based on the projection onto convex sets (POCS) theory. Simulation results demonstrate that the proposed algorithm reconstructs 3-D mesh surfaces faithfully even in severe error prone environments.

    Original languageEnglish
    Article number1703503
    Pages (from-to)885-895
    Number of pages11
    JournalIEEE Transactions on Multimedia
    Volume8
    Issue number5
    DOIs
    Publication statusPublished - 2006 Oct

    Bibliographical note

    Funding Information:
    Manuscript received October 10, 2005; revised February 23, 2006. This work was supported in part by the Ministry of Information and Communication, Korea, under the Information Technology Research Center support program supervised by the Institute of Information Technology Assessment (IITA-2005-C1090-0502-0038). The associate editor coordinating the review of this manuscript and approving it for publication was Dr. Alexander Loui.

    Keywords

    • 3-D mesh compression
    • Error concealment
    • POCS
    • Robust transmission
    • Shape adaptive mesh partitioning

    ASJC Scopus subject areas

    • Signal Processing
    • Media Technology
    • Computer Science Applications
    • Electrical and Electronic Engineering

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