Experimental analysis of a splice method between YBCO coated conductors on various bending diameters

Ki Sung Chang, Dong Keun Park, Seong Eun Yang, Hyun Chul Jo, Hyung Jun Kim, Yong Soo Yoon, Hyun Sung Kim, Haigun Lee, Tae Kuk Ko

    Research output: Contribution to journalArticlepeer-review

    11 Citations (Scopus)

    Abstract

    In recent years, the YBCO coated conductor (CC) has been developed as a suitable material for commercial superconducting apparatuses. In general, YBCO CC in superconducting apparatuses is wound into a coil. In order to fabricate a superconducting magnet of a large capacity, the splice between the CC tapes is inevitable because of the length and the shape of the CC tapes. In the previous researches, we have developed a splice method for short YBCO CC tape. However, the splice in a coil or between coils has certain bending diameters. Thus, we have developed a soldering machine capable of soldering on various bending diameters in this research. The splices varying with pressures, a temperature profile, a solder and bending diameters between YBCO CC tapes were conducted. The characteristics of each splice method were measured from V-I curve and a suitable splice method for superconducting magnets was developed.

    Original languageEnglish
    Article number5433302
    Pages (from-to)1577-1580
    Number of pages4
    JournalIEEE Transactions on Applied Superconductivity
    Volume20
    Issue number3
    DOIs
    Publication statusPublished - 2010 Jun

    Bibliographical note

    Funding Information:
    Manuscript received October 20, 2009. First published March 18, 2010; current version published May 28, 2010. This research was supported by National Research Laboratory Program through the Korea Science and Engineering Foundation funded by the Ministry of Education, Science and Technology (R0A-2007-000-20063-0).

    Keywords

    • Bending diameter
    • Cooling rate
    • Pressure
    • Solder
    • Splice

    ASJC Scopus subject areas

    • Electronic, Optical and Magnetic Materials
    • Condensed Matter Physics
    • Electrical and Electronic Engineering

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