Experimental analysis on the anodic bonding with an evaporated glass layer

Woo Beom Choi, Byeong Kwon Ju, Yun Hi Lee, Jee Won Jeong, M. R. Haskard, Nam Yang Lee, Man Young Sung, Myung Hwan Oh

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17 Citations (Scopus)


We performed a silicon-to-silicon anodic bonding process using a glass layer deposited by electron beam evaporation. Corning No 7740 Pyrex glass was used as the source material of electron evaporation. The effects on the bonding process were investigated as a function of the thickness of the glass layer and the concentration of sodium ions in the glass layer. The surface roughness of the glass layer decreased with increasing thickness of the glass layer. It was observed that the deposited glass layers of more than 1.5 μm thickness had very small surface roughness. The depth profile of sodium ions showed that the glass layer deposited by electron beam evaporation contained many more sodium ions than the glass layer deposited by sputtering. The silicon-to-silicon bonding process was performed at temperatures in the range of 135-240 °C with an electrostatic voltage in the range of 35-100 VDC. A pull test revealed that the tensile strength of bonded specimens was in the region of 1-8 MPa. The role of sodium ions in anodic bonding was studied by investigating the theoretical bonding mechanism and examining the results of secondary-ion mass spectroscopy (SIMS) analysis on the glass layer before and after the bonding process.

Original languageEnglish
Pages (from-to)316-322
Number of pages7
JournalJournal of Micromechanics and Microengineering
Issue number4
Publication statusPublished - 1997 Dec

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering


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