TY - GEN
T1 - Fabrication and characteristics of MEMS vertical type probe tip for micro sized pads measurement
AU - Kim, Jin Hyuk
AU - Chu, Sung Il
AU - Seo, Ho Won
AU - Ryu, Jae Wook
AU - Kim, Gye Tae
AU - Moon, Sung
PY - 2007
Y1 - 2007
N2 - In this research we proposed, designed, fabricated, and measured a novel Micro Electro Mechanical System (MEMS) based vertical probe tips which differs from conventional cantilever probe tips. The main idea of the vertical probe design was how to distribute the total forces vertically concentrated on the probe tip in measuring semiconductor devices. To solve the problem, we designed the vertical probe tip with meander structure which could provide enough displacements so that the vertical probe tips could distribute the forces acting on the tips. The structural analyses of the probe tip were accomplished using finite element method (FEM) and compared with actual measurement values. The primary fabrication processes were surface micromachining, wafer bonding technology, and electroplating. The material of the electro-plated probe tip was an Ni-Co alloy. In this study, we demonstrated the potential of the vertical probe tip that could apply to a small area with the over drive (O.D.) of 10-40 μm and the contact force of 1-8 gf. The measured contact resistance was less than 2 Ω and little noise was observed.
AB - In this research we proposed, designed, fabricated, and measured a novel Micro Electro Mechanical System (MEMS) based vertical probe tips which differs from conventional cantilever probe tips. The main idea of the vertical probe design was how to distribute the total forces vertically concentrated on the probe tip in measuring semiconductor devices. To solve the problem, we designed the vertical probe tip with meander structure which could provide enough displacements so that the vertical probe tips could distribute the forces acting on the tips. The structural analyses of the probe tip were accomplished using finite element method (FEM) and compared with actual measurement values. The primary fabrication processes were surface micromachining, wafer bonding technology, and electroplating. The material of the electro-plated probe tip was an Ni-Co alloy. In this study, we demonstrated the potential of the vertical probe tip that could apply to a small area with the over drive (O.D.) of 10-40 μm and the contact force of 1-8 gf. The measured contact resistance was less than 2 Ω and little noise was observed.
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M3 - Conference contribution
AN - SCOPUS:42549146657
SN - 1424409519
SN - 9781424409518
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 283
EP - 286
BT - Proceedings - CIS Workshops 2007, 2007 International Conference on Computational Intelligence and Security Workshops, CISW 2007
T2 - 20th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2007
Y2 - 21 January 2007 through 25 January 2007
ER -